Patents by Inventor Paul Frederick Smith

Paul Frederick Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180130639
    Abstract: Methods and systems for generating a plasma using an external plasma system are described. The plasma system may include an energy coupling device (e.g., an electromagnetic coil or capacitor) that is submersed within a liquid coolant and powered by an RF source. In some embodiments, a C-shaped magnetic core may be submersed within the liquid coolant and one or more plasma tubes may be arranged within an opening of the C-shaped magnetic core between the ends of the C-shaped magnetic core. To generate a plasma in a first tube of the one or more plasma tubes, a gas may be inserted into the first tube while the RF source drives a coil surrounding a portion of the C-shaped magnetic core to couple electromagnetic energy into the gas within the first tube.
    Type: Application
    Filed: April 29, 2016
    Publication date: May 10, 2018
    Inventors: Michael Nicholas Vranich, Paul Frederick Smith
  • Patent number: 7026238
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: April 11, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin
  • Publication number: 20040209460
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Application
    Filed: May 7, 2004
    Publication date: October 21, 2004
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin
  • Publication number: 20020060363
    Abstract: Embodiments of the present invention provide a process sequence and related hardware for filling a patterned feature on a substrate with a metal, such as copper. The sequence comprises first forming a reliable barrier layer in the patterned feature to prevent diffusion of the metal into the dielectric layer through which the patterned feature is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the barrier layer at the bottom of the patterned feature, depositing a second barrier layer, and then filling the patterned feature with a metal, such as copper.
    Type: Application
    Filed: January 17, 2002
    Publication date: May 23, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Ming Xi, Paul Frederick Smith, Ling Chen, Michael X. Yang, Mei Chang, Fusen Chen, Christophe Marcadal, Jenny C. Lin
  • Patent number: 5983906
    Abstract: The present invention provides systems, methods and apparatus for depositing titanium films at rates up to 200 .ANG./minute on semiconductor substrates from a titanium tetrachloride source. In accordance with an embodiment of the invention, a ceramic heater assembly with an integrated RF plane for bottom powered RF capability allows PECVD deposition at a temperature of at least 400.degree. C. for more efficient plasma treatment. A thermal choke isolates the heater from its support shaft, reducing the thermal gradient across the heater to reduce the risk of breakage and improving temperature uniformity of the heater. A deposition system incorporates a flow restrictor ring and other features that allow a 15 liters/minute flow rate through the chamber with minimal backside deposition and minimized deposition on the bottom of the chamber, thereby reducing the frequency of chamber cleanings, and reducing clean time and seasoning. Deposition and clean processes are also further embodiments of the present invention.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: November 16, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Jun Zhao, Lee Luo, Jia-Xiang Wang, Xiao Liang Jin, Stefan Wolff, Talex Sajoto, Mei Chang, Paul Frederick Smith
  • Patent number: 5671141
    Abstract: A computer program architecture for a motor vehicle on-board diagnostic system includes a plurality of monitor modules for monitoring vehicle systems or components and issuing a malfunction subroutine call to a diagnostic executive upon detecting a system or component malfunction. The executive includes a plurality of software objects or modules for carrying out malfunction indicator light control and fault code storage strategies. A diagnostic scheduler module implemented as a finite state machine, controls and coordinates the sequence of the test to be run by the monitor modules as well as on-demand self tests. A malfunction indicator light (MIL) control module implements four distinct light control strategies through finite machines for illuminating and extinguishing the light and for storing and erasing fault codes under predetermined conditions.
    Type: Grant
    Filed: April 5, 1993
    Date of Patent: September 23, 1997
    Assignee: Ford Global Technologies, Inc.
    Inventors: Paul Frederick Smith, John Frederick Armitage, Eric Blaine Ferch