Abstract: Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for preparing a solvent-based adhesive composition, the methods comprising providing a polyester-urethane resin, providing an epoxy-terminated polyester compound, mixing the polyester-urethane resin, epoxy-terminated polyester compound, and phosphoric acid to form a resin mixture, diluting the resin mixture in a solvent to form a diluted resin mixture having an application solid content from 25 to 55 weight percent, based on the total weight of the diluted resin mixture, and curing the diluted resin mixture with an aliphatic isocyanate curing agent at a mix ratio (parts by weight resin mixture before dilution:parts by weight aliphatic isocyanate curing agent) of from 100:1 to 100:12.

Abstract: The present disclosure provides a two-component solvent-based adhesive composition. The two-component solvent-based adhesive composition contains the reaction product of (A) an isocyanate component; (B) a polyol component containing a polyester-amide polycarbonate polyol; and (C) a solvent. The present disclosure also provides a method of forming the two-component solvent-based adhesive composition.

Abstract: The present disclosure provides a two-component solvent-based adhesive composition. The two-component solvent-based adhesive composition contains the reaction product of (A) an isocyanate component; (B) a polyol component containing a polyester-amide polycarbonate polyol; and (C) a solvent. The present disclosure also provides a method of forming the two-component solvent-based adhesive composition.

Abstract: The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component; and (B) a polyol component containing (i) a polyester-polycarbonate polyol and (ii) a phosphate-terminated polyol. The present disclosure also provides a method of forming the two-component solvent-less adhesive composition.

Abstract: The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.

Abstract: The present disclosure provides a two-component solvent-based adhesive composition. The two-component solvent-based adhesive composition contains the reaction product of (A) an isocyanate component; (B) a polyol component containing (i) a polyester-polycarbonate polyol and (ii) a phosphate-terminated polyol; and (iii) a solvent. The present disclosure also provides a method of forming a two-component solvent-based adhesive composition.

Abstract: Solvent-based adhesive composition are disclosed, the compositions comprising (A) a polyester-urethane resin, (B) an epoxy-terminated polyester compound, (C) a phosphoric acid, and (D) an aliphatic isocyanate curing agent. Methods for preparing a solvent-based adhesive composition, the methods comprising providing a polyester-urethane resin, providing an epoxy-terminated polyester compound, mixing the polyester-urethane resin, epoxy-terminated polyester compound, and phosphoric acid to form a resin mixture, diluting the resin mixture in a solvent to form a diluted resin mixture having an application solid content from 25 to 55 weight percent, based on the total weight of the diluted resin mixture, and curing the diluted resin mixture with an aliphatic isocyanate curing agent at a mix ratio (parts by weight resin mixture before dilution:parts by weight aliphatic isocyanate curing agent) of from 100:1 to 100:12.

Abstract: Disclosed are methods for controlled radical polymerization of acrylic monomers using an organic photoredox catalyst, where the polymerization is mediated, as well as regulated, by light.

Abstract: [c2] daisy chain macromers, dimers and polymers and related compositions, materials, methods and systems are described.

Abstract: An internal precision oscillator (IPO) is trimmed within a microcontroller integrated circuit. The microcontroller integrated circuit receives a test program into flash memory on the microcontroller integrated circuit from a tester. The microcontroller integrated circuit also receives a reference signal from the tester. The IPO generates a clock signal having a frequency that depends upon a trim value. A general purpose timer on the microcontroller integrated circuit counts the number of cycles of the clock signal during a time period defined by the reference signal and outputs a digital value. A processor on the microcontroller integrated circuit executes the test program, reads the digital output, and adjusts the trim value such that the frequency of the clock signal is calibrated with respect to the reference signal. Test-time on the tester is reduced because the decision making during the frequency trimming process is made by the processor instead of the tester.

Abstract: [c2] daisy chain macromers, dimers and polymers and related compositions, materials, methods and systems are described.

Abstract: An internal precision oscillator (IPO) is trimmed within a microcontroller integrated circuit. The microcontroller integrated circuit receives a test program into flash memory on the microcontroller integrated circuit from a tester. The microcontroller integrated circuit also receives a reference signal from the tester. The IPO generates a clock signal having a frequency that depends upon a trim value. A general purpose timer on the microcontroller integrated circuit counts the number of cycles of the clock signal during a time period defined by the reference signal and outputs a digital value. A processor on the microcontroller integrated circuit executes the test program, reads the digital output, and adjusts the trim value such that the frequency of the clock signal is calibrated with respect to the reference signal. Test-time on the tester is reduced because the decision making during the frequency trimming process is made by the processor instead of the tester.