Abstract: The top and bottom parts of a one-piece cover of a PCMCIA card are snapped together to form lap-joint seams which are welded together with a laser, under argon gas. Only a few small tack welds are required to substantially increases the mechanical strength and moisture resistance and to eliminate the risk of accidentally opening the card. The operation can be done at a high rate with minimal cost. Also, an internal frame may be made much narrower to allow more card area, while still meeting structural requirements for PCMCIA cards. The weld penetrates fully through the first layer of the seam and only partially through a second layer. During welding a fixture holds the seams in reasonably precise position and tightly closed so the seams are much tighter after welding than when the card is only snap closed. The precise positioning of the seams also allows the size of the weld to be minimized which reduces the risk of burn through which may damage electronic components enclosed within the card during welding.

Abstract: A cartridge having top and bottom metal covers which enclose a circuit board, the metal of the covers forming a seam which is welded at locations therealong to bond the two covers together. The covers may form a snap-fit, lap, or butting seam where the welds are applied. The cartridge is particularly useful in PCMCIA applications.

Abstract: The present invention features an improvement in the construction and manufacturing of small peripheral cartridges which plug into exterior slots of computer systems such as PCMCIA cards. The metal cover of a snap-together PCMCIA card is typically tack welded at its seams An inexpensive and highly accurate welding technique is presented for performing this welding operation. The inventive welding technique may be used without risk of damage to highly sensitive electronic components. The lap joint seam formed using the techniques exhibits the strength and stiffness characteristics that allow the size of welded seams to be minimized thereby also reducing the risk of burn-through or other damage to the cards during manufacturing.