Abstract: A system for providing driver status to a driver of a vehicle includes a data processor, a plurality of sensors mounted within the vehicle and adapted to send vehicle information to the data processor, a driver monitoring system within the vehicle adapted to send driver information to the data processor, the data processor further adapted to collect information from external sources via a wireless data communication network, and a driver state display adapted to receive information from the data processor and to display a short-term status indicator, a long-term status indicator and contextual information.

Abstract: A system for providing driver status to a driver of a vehicle includes a data processor, a plurality of sensors mounted within the vehicle and adapted to send vehicle information to the data processor, a driver monitoring system within the vehicle adapted to send driver information to the data processor, the data processor further adapted to collect information from external sources via a wireless data communication network, and a driver state display adapted to receive information from the data processor and to display a short-term status indicator, a long-term status indicator and contextual information.

Abstract: A forming body of a glass forming apparatus may include a first conduit comprising a first conduit wall and at least one slot in the first conduit wall, and a second conduit disposed above and vertically aligned with the first conduit, the second conduit comprising a second conduit wall and a slot extending through the second conduit wall. The forming body may include a first vertical wall and a second vertical wall extending between an outer surface of the second conduit wall and an outer surface of the first conduit wall at a first side and a second side, respectively, of the forming body. The forming body may include a first forming surface and a second forming surface extending from an outer surface of the first conduit wall and converging at a root of the forming body. Methods of forming a continuous laminate glass ribbon are also disclosed.

Abstract: A closed loop steam engine that transfers its motive power to a flow of water using a steam injector. The resulting water jet then drives a turbine, is cooled in a heat exchanger to extract useful heat and then return to the steam injector water inlet. Part of the flow of water is reused as feed water to the boiler.

Abstract: A closed loop steam engine that transfers its motive power to a flow of water using a steam injector. The resulting water jet then drives a turbine, is cooled in a heat exchanger to extract useful heat and then return to the steam injector water inlet. Part of the flow of water is reused as feed water to the boiler.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A container sealing apparatus 10 comprises an electrically conductive linearly displaceable cutting member 14 operable to cut a portion 18 of sealing material from a web 16 and an independently linearly displaceable transfer member 42 comprising an electrically insulating material and extendible relative to the cutting member 14 to transfer the cut portion 18 of sealing material to an open top of a container 12 to be sealed. An induction coil 52 produces an induction field 54 for heating the cut portion 18 of sealing material, either directly or indirectly, by induction heating to seal the cut portion 18 of sealing material to the open top of the container 12. The linearly displaceable transfer member 42 holds the cut portion 18 of sealing material against the open top of the container 12 during induction heating.

Abstract: A container sealing apparatus 10 comprises an electrically conductive linearly displaceable cutting member 14 operable to cut a portion 18 of sealing material from a web 16 and an independently linearly displaceable transfer member 42 comprising an electrically insulating material and extendible relative to the cutting member 14 to transfer the cut portion 18 of sealing material to an open top of a container 12 to be sealed. An induction coil 52 produces an induction field 54 for heating the cut portion 18 of sealing material, either directly or indirectly, by induction heating to seal the cut portion 18 of sealing material to the open top of the container 12. The linearly displaceable transfer member 42 holds the cut portion 18 of sealing material against the open top of the container 12 during induction heating.

Abstract: An electrochemical noise method, apparatus and system calculates parameters of interest related to corrosion rates of an electrically conductive article. The method involves placing a test electrode, a reference electrode, and an auxiliary electrode in an environment of interest; placing the test electrode under potentiostatic control regime for a potential scan; measuring the relationship of current v. potential (polarization resistance, Rp) of the test electrode relative to the reference electrode during a first period; switching from potentiostatic control to the open circuit potential (OCP) of the test electrode; monitoring the OCP of the test electrode during a second period; determining ?I from the relationship Rp=?V/?I, where ?V is measured over a second period of time; and calculating the localized corrosion from the measured potential and current data.

Abstract: Simultaneous determination of general corrosion and localized corrosion rate measurements is achieved with polarization applied by the electrodes themselves rather than externally applied polarization. Two or more working electrodes may be galvanically coupled. A localized pitting corrosion event on one of the electrodes will lead to a potential transient. The area within the potential transient is measured with the baseline being the initial starting potential. This gives localized corrosion as a function of time. The relationship Rp=?V/?I is calculated, where Rp is the polarization resistance of the working electrodes and is a measure of generalized corrosion rate.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: An assembly for controlling delivery of material from a bin opening includes a movable bin gate for closing the bin opening and providing a high flow rate of material when the movable gate is open, wherein a low flow aperture is formed in the bin gate to provide a low flow rate of material when the bin gate is positioned such that only the low flow aperture is open. A two-stage flow enhancer within the bin includes a first stage for impelling material in the direction of the low flow aperture and a second stage for impelling material to exit through the low flow aperture. A controller controls operation of the bin gate to adjust a flow rate of material from the bin opening.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A sealing arrangement comprising a first membrane having a periphery and a second membrane comprising a first portion overlying the first membrane and a second portion extending from the first portion, wherein the first membrane is substantially wholly attached to the first portion of the second membrane.