Patents by Inventor Paul H. Wiese

Paul H. Wiese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5612596
    Abstract: A solid state load switching conservation circuit removably connectable with a control output of a traffic control logic circuit and responsive to an actuating input to energize an incandescent lamp from an a.c. power source exhibiting a given voltage level. The switching circuit conserves electrical power consumption and the life span of incandescent lamps and, in this regard, employs a thyristor switch, triac driver, shunting network, voltage level monitoring network, a.c. cycle monitoring network, and processor to provide a soft start form of turn on for the lamps being energized. Subsequent to the completion of soft start control, the conservation approach of the invention then turns to a voltage regulation mode which regulates the voltage applied to the lamp during traffic logic control illumination intervals such that the lamp is energized at an acceptable but lowered RMS voltage to conserve both energy and lamp life spans.
    Type: Grant
    Filed: October 16, 1995
    Date of Patent: March 18, 1997
    Assignee: Conservation Load Switch, Inc.
    Inventor: Paul H. Wiese
  • Patent number: 4916807
    Abstract: Surface mounted circuit components having surface mount leads are mounted upon circuit boards having corresponding patterns of surface mount pads by a procedure wherein a male mold is made by positioning mold defining circuit components upon a transparent spacer which, in turn, is positioned over a circuit board or the equivalent. The transparent spacer is provided having vacuum transmission openings in it and the assemblage is positioned within vacuum forming apparatus to provide a transparent female mold. An arrangement for locating alignment pins may also be developed for the female mold. The female molds are mounted upon a universal back board along with alignment pins and production circuit components are inserted therein. Production circuit boards then are positioned over the female molds and inserted circuit components along with an adhesive for use in subsequent flow soldering connections, or a Re-Flow solder for that form of lead connection.
    Type: Grant
    Filed: January 5, 1989
    Date of Patent: April 17, 1990
    Inventor: Paul H. Wiese