Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to oscillator systems which employ a plurality of microelectromechanical resonating structures, and methods to control and/or operate same. The oscillator systems are configured to provide and/or generate one or more output signals having a predetermined frequency over temperature, for example, (1) an output signal having a substantially stable frequency over a given/predetermined range of operating temperatures, (2) an output signal having a frequency that is dependent on the operating temperature from which the operating temperature may be determined (for example, an estimated operating temperature based on a empirical data and/or a mathematical relationship), and/or (3) an output signal that is relatively stable over a range of temperatures (for example, a predetermined operating temperature range) and is “shaped” to have a desired turn-over frequency.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to oscillator systems which employ a plurality of microelectromechanical resonating structures, and methods to control and/or operate same. The oscillator systems are configured to provide and/or generate one or more output signals having a predetermined frequency over temperature, for example, (1) an output signal having a substantially stable frequency over a given/predetermined range of operating temperatures, (2) an output signal having a frequency that is dependent on the operating temperature from which the operating temperature may be determined (for example, an estimated operating temperature based on a empirical data and/or a mathematical relationship), and/or (3) an output signal that is relatively stable over a range of temperatures (for example, a predetermined operating temperature range) and is “shaped” to have a desired turn-over frequency.

Abstract: The invention provides a wafer-level package for a micromirror array. The wafer-level package includes a substrate including a wafer having a substrate surface with a plurality of actuatable micromirrors coupled to the substrate surface. An optical window is attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface. A beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity.

Abstract: The invention provides a micromirror for directing a beam of light. The micromirror includes a mirror plate movably coupled to a substrate and a lower reinforcement rib connected to a lower surface of the mirror plate. The lower reinforcement rib is formed in a rib trench within the substrate when at least a portion of the mirror plate is formed. The lower reinforcement rib reinforces the mirror plate to minimize mirror plate curvature. A system for directing a beam of light and a method of fabricating a reinforced micromirror is also disclosed.