Abstract: A package is provided for a pair of microwave semiconductor devices, such package comprising upper and lower mating covers, each one of such covers having bonded thereto a corresponding one of the pair of microwave semiconductor devices. With such arrangement, after the devices are bonded to the cover to form a component of the package, the effective impedance of the thus formed component is electrically characterized, or measured. Having characterized a large quantity of such components, the components are then sorted into bins with components having substantially matched characteristics being placed in a common one of the bins. Pairs of such components in a common bin are used as the upper and lower cover for the package. Thus, assembly time is significantly reduced since additional matching compensation techniques are not required.