Patents by Inventor Paul J. Hart

Paul J. Hart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
    Publication number: 20080164300
    Abstract: A method of making a circuitized substrate (e.g., a chip carrier) with solder balls thereon which are each formed in such a manner so as to have rough surfaces thereon, thereby providing enhanced connections with conductors (e.g., conductive sites) of an electronic device (e.g., a semiconductor chip). Methods of making an electrical assembly including both substrate and device, as well as this assembly and another substrate, thereby forming a multiple substrate assembly, are also provided.
    Type: Application
    Filed: January 8, 2007
    Publication date: July 10, 2008
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: David J. Alcoe, Paul J. Hart
  • High density pattern template: materials and processes for the application of conductive pastes
    Patent number: 5460921
    Abstract: The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured.
    Type: Grant
    Filed: September 8, 1993
    Date of Patent: October 24, 1995
    Assignee: International Business Machines Corporation
    Inventors: Douglas A. Cywar, Charles R. Davis, Thomas P. Duffy, Frank D. Egitto, Paul J. Hart, Gerald W. Jones, Edward McLeskey
  • Method for filling plated through holes
    Patent number: 5435480
    Abstract: Plated thru holes in a printed circuit card or board are filled with solder to provide as void free as possible solder fill. According to one method, an adhesive film is provided on the bottom side of a circuit card or board containing plated thru holes. A plurality of solder balls are then provided within at least one thru hole of the card or board. The total volume of the solder balls is greater than the volume of the plated thru hole. The solder balls are reflowed to thereby fill the plated thru hole with solder and provide solder on top of the thru hole.According to another method, a solder ball is provided above and in contact with a plated thru hole. The volume of the solder ball is greater than the volume of the plated thru hole. The solder ball is reflowed to thereby fill the plated thru hole with solder, and to provide solder both above and below the plated thru hole.
    Type: Grant
    Filed: December 23, 1993
    Date of Patent: July 25, 1995
    Assignee: International Business Machines Corporation
    Inventors: Paul J. Hart, Kishor V. Desai, Edward Vytlacil, Ajit K. Trivedi