Abstract: A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (24) of the preform and an outer end surface portion (22) of the contact finger both directly engage a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (28) having the outer end surface portion (22) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded in the soldered connection in firm engagement with the contact pad (14).

Abstract: A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more than 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation.

Abstract: A solder-bearing lead (10) is provided with solder flow-control stops (20 and 22) on opposite surfaces of a contact finger (18) closely adjacent a flux-bearing solder preform (12) on the contact finger, to preclude flow of molten solder from the solder preform along the contact finger to a stem (26) of the lead in a soldering operation. The first solder flow-control stop (20) forces the molten solder to flow directly across sides of the contact finger (18) to a contact pad (14), where it is confined by the second solder flow-control stop (22) to form a soldered connection (24) in a reduced time period and without the necessity for any significant supplemental fluxing. Additional solder flow-control stops (38 and 40) also are formed on resilient spring clamping fingers (28) of the lead. The solder flow-control stops (20, 22, 38 and 40) are formed by oxidized portions of a phosphor bronze base metal from which portions of solder-wettable tin coatings (42 and 44) have been removed.

Abstract: Solderable leads (22) of the type which project in parallel relationship from a continuous independent support rail (30) are rapidly and efficiently assembled to substrates (26) by simultaneously feeding a pair of the independent support rails (30) and their associated leads (22) to locate successive leading sets of leads (22) on opposite sides of a lead-substrate assembling position (36). In the assembling position outer portions of the leading sets of leads (22) are engaged to move the leads (22) in opposite directions toward a substrate (26), so as to cut the support rails (30) and thus sever the leading sets of leads (22) from the remaining leads (22) on the support rails (30). Continued movement of the severed sets of leads (22) then causes the leads (22) to be assembled to respective opposite sides of the substrate (26) simultaneously.