Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Abstract: A microelectromechanical systems (MEMS) accelerometer that has high sensitivity to motion along the z axis is discussed. The device includes two symmetrical sets of bilateral, diametrically opposed high aspect ratio flexures that tether a movable proof mass to the frame of the device. The flexures are designed in such a way as to restrict movement of the proof mass along the x and y axes but readily allow motion along the z axis. More specifically, when the device experiences an acceleration along the x or y axes, the proof mass is restricted from moving because some of the bilateral, diametrically opposed flexures are in compression and others are in tension.

Abstract: A platform for trapping atomic ions includes a substrate and a plurality of metallization layers that overlie the substrate. The metallization layer farthest from the substrate is a top layer patterned with electrostatic control trap electrodes and radio-frequency trap electrodes. Another metallization layer is a microwave layer patterned to define a microwave circuit. The microwave layer lies below the top layer. The microwave circuit is adapted to generate, in use, a microwave magnetic field above the electrostatic control and radio-frequency trap electrodes. The top metallization layer includes slots that, in use, are penetrated by microwave energy from the microwave circuit.

Abstract: Tunable filters can use Fano metasurface designs having extremely narrow transmission bands. The Fano metasurface can comprise dielectric or semiconductor materials and can produce transmission bands with quality factors well in excess of 1000—at least a factor of 50 greater than typical metamaterial-based infrared resonances. Numerical simulations of these metasurfaces show that the spectral position of the passband can be changed by slightly changing the position of a small dielectric perturbation block placed within the near-field of the resonator by using simple electromechanical actuation architectures that allow for such motion. An array of independently tunable narrowband infrared filters can thereby be fabricated that only requires deep-subwavelength motions of perturbing objects in the resonator's near-field.

Abstract: A method, system and apparatus including a device cell having a top side, a bottom side and opposing side walls. A passivation layer is formed along the top side, the bottom side and opposing side walls of the device cell. The passivation layer serves to passivate the device cell and facilitate carrier collection around the device cell. An anti-reflective layer is formed over the passivation layer and an optical layer is formed on the top side of the device cell. The optical layer reflects light within the device cell. The apparatus may further include a reflective layer formed along the bottom side of the device cell, the reflective layer to reflect light internally within the device cell.

Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.

Abstract: An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.

Abstract: Tunable filters can use Fano metasurface designs having extremely narrow transmission bands. The Fano metasurface can comprise dielectric or semiconductor materials and can produce transmission bands with quality factors well in excess of 1000—at least a factor of 50 greater than typical metamaterial-based infrared resonances. Numerical simulations of these metasurfaces show that the spectral position of the passband can be changed by slightly changing the position of a small dielectric perturbation block placed within the near-field of the resonator by using simple electromechanical actuation architectures that allow for such motion. An array of independently tunable narrowband infrared filters can thereby be fabricated that only requires deep-subwavelength motions of perturbing objects in the resonator's near-field.

Abstract: An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

Abstract: There is provided an electronic device and a method for its manufacture. The device comprises an elongate silicon nanowire less than 0.5 ?m in cross-sectional dimensions and having a hexagonal cross-sectional shape due to annealing-induced energy relaxation. The method, in examples, includes thinning the nanowire through iterative oxidation and etching of the oxidized portion.

Abstract: There is provided an electronic device and a method for its manufacture. The device comprises an elongate silicon nanowire less than 0.5 ?m in cross-sectional dimensions and having a hexagonal cross-sectional shape due to annealing-induced energy relaxation.

Abstract: Photovoltaic cells and photovoltaic modules, as well as methods of making and using such photovoltaic cells and photovoltaic modules, are disclosed. More particularly, embodiments of the photovoltaic cells selectively reflect visible light to provide the photovoltaic cells with a colorized appearance. Photovoltaic modules combining colorized photovoltaic cells may be used to harvest solar energy while providing a customized appearance, e.g., an image or pattern.

Abstract: An integrated field emission array for ion desorption includes an electrically conductive substrate; a dielectric layer lying over the electrically conductive substrate comprising a plurality of laterally separated cavities extending through the dielectric layer; a like plurality of conically-shaped emitter tips on posts, each emitter tip/post disposed concentrically within a laterally separated cavity and electrically contacting the substrate; and a gate electrode structure lying over the dielectric layer, including a like plurality of circular gate apertures, each gate aperture disposed concentrically above an emitter tip/post to provide a like plurality of annular gate electrodes and wherein the lower edge of each annular gate electrode proximate the like emitter tip/post is rounded. Also disclosed herein are methods for fabricating an integrated field emission array.

Abstract: A low-power miniaturized photoacoustic sensor uses an optical microphone made by semiconductor fabrication techniques, and optionally allows for all-optical communication to and from the sensor. This allows integration of the photoacoustic sensor into systems with special requirements, such as those that would be reactive in an electrical discharge condition. The photoacoustic sensor can also be operated in various other modes with wide application flexibility.

Abstract: Disclosed is an encapsulated micro-diode and a method for producing same. The method comprises forming a plurality columns in the substrate with a respective tip disposed at a first end of the column, the tip defining a cathode of the diode; disposing a sacrificial oxide layer on the substrate, plurality of columns and respective tips; forming respective trenches in the sacrificial oxide layer around the columns; forming an opening in the sacrificial oxide layer to expose a portion of the tips; depositing a conductive material in of the opening and on a surface of the substrate to form an anode of the diode; and removing the sacrificial oxide layer.

Abstract: Technologies pertaining to designing microsystems-enabled photovoltaic (MEPV) cells are described herein. A first restriction for a first parameter of an MEPV cell is received. Subsequently, a selection of a second parameter of the MEPV cell is received. Values for a plurality of parameters of the MEPV cell are computed such that the MEPV cell is optimized with respect to the second parameter, wherein the values for the plurality of parameters are computed based at least in part upon the restriction for the first parameter.

Abstract: A process including forming a photovoltaic solar cell on a substrate, the photovoltaic solar cell comprising an anchor positioned between the photovoltaic solar cell and the substrate to suspend the photovoltaic solar cell from the substrate. A surface of the photovoltaic solar cell opposite the substrate is attached to a receiving substrate. The receiving substrate may be bonded to the photovoltaic solar cell using an adhesive force or a metal connecting member. The photovoltaic solar cell is then detached from the substrate by lifting the receiving substrate having the photovoltaic solar cell attached thereto and severing the anchor connecting the photovoltaic solar cell to the substrate. Depending upon the type of receiving substrate used, the photovoltaic solar cell may be removed from the receiving substrate or remain on the receiving substrate for use in the final product.