Patents by Inventor Paul Lindner
Paul Lindner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9666470Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: GrantFiled: March 27, 2013Date of Patent: May 30, 2017Assignee: EV GROUP E. THALLNER GMBHInventors: Erich Thallner, Friedrich Paul Lindner
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Patent number: 9653329Abstract: A semiconductor processing device with bearing means for supporting a plate with one plate plane. The plate has a function region with evenness, a bearing region which surrounds the function region at least in sections, and an action region which is located outside the function region and outside the bearing region. The bearing means is made to support the plate in the bearing region and the action means is controllable such that by deformation of the function region the evenness can be adjusted and/or changed and/or influenced and/or re-set. The action means comprise at least one vacuum region which allows a deformation of the plate in the bearing region.Type: GrantFiled: November 19, 2013Date of Patent: May 16, 2017Assignee: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Publication number: 20170110377Abstract: A method for equalizing the thickness variation of a substrate stack comprised of a product substrate and a carrier substrate and which is connected in particular by means of an interconnect layer, by local application of local thickness peaks by means of an application apparatus which has at least one application unit. Furthermore this invention relates to a corresponding device.Type: ApplicationFiled: March 31, 2015Publication date: April 20, 2017Applicant: EV Group E. Thallner GmbHInventors: Jurgen Burggraf, Friedrich Paul Lindner
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Publication number: 20160336203Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.Type: ApplicationFiled: February 3, 2014Publication date: November 17, 2016Applicant: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Patent number: 9457552Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.Type: GrantFiled: May 19, 2015Date of Patent: October 4, 2016Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf
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Patent number: 9449863Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.Type: GrantFiled: November 10, 2014Date of Patent: September 20, 2016Assignee: EV Group GmbHInventors: Jurgen Burggraf, Friedrich Paul Lindner, Stefan Pargfrieder, Daniel Burgstaller
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Patent number: 9381732Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.Type: GrantFiled: November 25, 2014Date of Patent: July 5, 2016Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf
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Patent number: 9381729Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.Type: GrantFiled: June 18, 2013Date of Patent: July 5, 2016Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf
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Patent number: 9272501Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.Type: GrantFiled: March 29, 2011Date of Patent: March 1, 2016Assignee: EV Group GmbHInventors: Jürgen Burggraf, Friedrich Paul Lindner
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Publication number: 20160020136Abstract: The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more recesses provided relative to the retaining surface, for retaining first magnetic bodies for securing the first substrate relative to a second substrate that is aligned with the first substrate. Second magnetic bodies are applied on a holding side of the second substrate.Type: ApplicationFiled: March 27, 2013Publication date: January 21, 2016Applicant: EV GROUP E. THALLNER GMBHInventors: Erich THALLNER, Friedrich Paul LINDNER
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Patent number: 9186877Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.Type: GrantFiled: November 24, 2014Date of Patent: November 17, 2015Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf
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Patent number: 9138978Abstract: Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.Type: GrantFiled: February 28, 2013Date of Patent: September 22, 2015Assignee: EV Group GmbHInventors: Markus Wimplinger, Friedrich Paul Lindner
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Publication number: 20150262849Abstract: A semiconductor processing device with bearing means for supporting a plate with one plate plane. The plate has a function region with evenness, a bearing region which surrounds the function region at least in sections, and an action region which is located outside the function region and outside the bearing region. The bearing means is made to support the plate in the bearing region and the action means is controllable such that by deformation of the function region the evenness can be adjusted and/or changed and/or influenced and/or re-set. The action means comprise at least one vacuum region which allows a deformation of the plate in the bearing region.Type: ApplicationFiled: November 19, 2013Publication date: September 17, 2015Applicant: EV GROUP E. THALLNER GMBHInventor: Friedrich Paul Lindner
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Publication number: 20150251404Abstract: Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.Type: ApplicationFiled: May 19, 2015Publication date: September 10, 2015Inventors: Friedrich Paul Lindner, Jurgen Burggraf
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Publication number: 20150251349Abstract: A method for embossing a structure material on a substrate disposed within a device having side walls, a base plate and a cover that define a working space that is isolated from a surrounding environment. The method includes the steps of: a) moving the substrate using a first calibration means and aligning the substrate with an application means, b) applying the structure material to the substrate, c) moving the substrate using a second calibration means that is located at least partially in the working space wherein the substrate is disposed within the working space and is aligned with an embossing means that is located at least partially in the working space, and d) embossing the structure material on the substrate while the substrate is in the working space using the embossing means, wherein the working space has a defined atmosphere, before and during the step of embossing, without interruption.Type: ApplicationFiled: May 20, 2015Publication date: September 10, 2015Applicant: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
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Patent number: 9116424Abstract: The invention relates to a device for embossing of substrates, especially semiconductor substrates or wafers, comprised of: at least one receiving means for holding the substrate in a working space, a calibration means located at least partially in the working space for calibration of the substrate, an embossing means which is located at least partially in the working space for embossing of the structure material onto the substrate in an embossing process, the working space being exposed to a defined atmosphere before and during the embossing process without interruption, and a method for embossing of substrates.Type: GrantFiled: August 18, 2010Date of Patent: August 25, 2015Assignee: EV Group E. Thallner GmbHInventors: Friedrich Paul Lindner, Thomas Glinsner, Markus Wimplinger
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Publication number: 20150210057Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: May 29, 2013Publication date: July 30, 2015Applicant: EV GROUP E. THALLNER GMBHInventors: Thomas Wagenleithner, Markus Wimplinger, Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20150096690Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.Type: ApplicationFiled: November 24, 2014Publication date: April 9, 2015Applicant: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf
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Publication number: 20150089783Abstract: A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.Type: ApplicationFiled: November 10, 2014Publication date: April 2, 2015Applicant: EV Group GmbHInventors: Jurgen BURGGRAF, Friedrich Paul LINDNER, Stefan PARGFRIEDER, Daniel BURGSTALLER
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Patent number: 8986496Abstract: Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.Type: GrantFiled: August 29, 2013Date of Patent: March 24, 2015Assignee: EV Group GmbHInventors: Friedrich Paul Lindner, Jurgen Burggraf