Patents by Inventor Paul M. Franzen

Paul M. Franzen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7887392
    Abstract: A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor and a flexible circuit operatively coupled to the sensor controller. The flexible circuit includes a first flexible sensor disposed proximate the first surface.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: February 15, 2011
    Assignee: Novellus Systems, Inc.
    Inventor: Paul M. Franzen
  • Publication number: 20080305717
    Abstract: A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor and a flexible circuit operatively coupled to the sensor controller. The flexible circuit includes a first flexible sensor disposed proximate the first surface.
    Type: Application
    Filed: June 6, 2007
    Publication date: December 11, 2008
    Applicant: NOVELLUS SYSTEMS, INC.
    Inventor: Paul M. Franzen