Abstract: Disclosed is a printhead including a substrate having a plurality of fluid heating elements. At least one fluid delivery slot delivers fluid to the plurality of fluid heating elements. The fluid delivery slot is defined by first and second substantially parallel side walls and first and second curved end walls. The fluid delivery slot is formed using a rotary cutting saw. The rotary cutting saw is used to form the fluid delivery slot in a single plunge cut or using the combination of a plunge cut and a drag cut. The use of the rotary cutting saw to form the fluid delivery slot produces narrow ink delivery slots thereby allowing the printhead substrate to exhibit an overall size reduction, as well as an increase in strength.

Abstract: The exemplary embodiments describe a semiconductor substrate having microelectronics integrated thereon. In one exemplary embodiment, the semiconductor substrate comprises a plurality of fluid ejecting elements positioned over a substrate. The semiconductor substrate can further comprise one or more fluid feed channel(s) formed in the substrate. The one or more fluid feed channel(s) being configured to deliver fluid to the plurality of fluid ejecting elements. The one or more fluid feed channel(s) are defined at least in part by first and second substantially parallel side walls and first and second non-parallel end walls.