Patents by Inventor Paul N. Becker
Paul N. Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7660096Abstract: In a composite electrical circuit protection device, thermal coupling between a planar PPTC element and a planar MOV element is controlled by insertion of a thermal mass material for regulating heat transfer from the MOV element to the PPTC element, such that a PPTC resistor hot zone forms consistently away from the planar major foil electrode confronting the MOV thereby regulating heat transfer from the MOV to the PPTC resistor.Type: GrantFiled: July 28, 2006Date of Patent: February 9, 2010Assignee: Tyco Electronics CorporationInventors: Boris Golubovic, Paul N. Becker, Robert P. Moore
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Patent number: 7148785Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).Type: GrantFiled: April 30, 2004Date of Patent: December 12, 2006Assignee: Tyco Electronics CorporationInventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
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Patent number: 6987440Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 ?m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 ?m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 ?m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.Type: GrantFiled: July 11, 2003Date of Patent: January 17, 2006Assignee: Tyco Electronics CorporationInventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
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Publication number: 20040218329Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).Type: ApplicationFiled: April 30, 2004Publication date: November 4, 2004Applicant: Tyco Electronics CorporationInventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
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Publication number: 20040104802Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 &mgr;m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 &mgr;m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 &mgr;m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.Type: ApplicationFiled: July 11, 2003Publication date: June 3, 2004Inventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
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Publication number: 20040006867Abstract: An electrical device (1) in which an element (7) composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode (3), the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer (11), and electrical devices using an adhesion promoting layer in combination with a crosslinking agent (9) are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.Type: ApplicationFiled: January 3, 2003Publication date: January 15, 2004Inventors: Paul N. Becker, James A. Rinde, Barry C. Mathews, Orion Jankowski, Cecilia A. Walsh, Ryan W. Dupon
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Patent number: 6593843Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 &mgr;m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 &mgr;m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 &mgr;m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.Type: GrantFiled: June 28, 2000Date of Patent: July 15, 2003Assignee: Tyco Electronics CorporationInventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
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Patent number: 6531950Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.Type: GrantFiled: June 28, 2000Date of Patent: March 11, 2003Assignee: Tyco Electronics CorporationInventors: Paul N. Becker, James A. Rinde, Barry C. Mathews, Orion Jankowski, Cecilia A. Walsh
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Patent number: 4376217Abstract: This invention provides a general method for the conversion of alkenes to primary vicinal diamines by use of a cobalt alkylnitroso complex and reduction with lithium aluminum hydride.Type: GrantFiled: October 1, 1981Date of Patent: March 8, 1983Assignee: Regents of the University of CaliforniaInventors: Robert G. Bergman, Paul N. Becker, Mary A. White
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Patent number: 4328164Abstract: This invention provides a general method for the conversion of alkenes to primary vicinal diamines by use of a cobalt alkylnitroso complex and reduction with lithium aluminum hydride.Type: GrantFiled: August 12, 1980Date of Patent: May 4, 1982Assignee: The Regents of the University of CaliforniaInventors: Robert G. Bergman, Paul N. Becker, Mary A. White