Patents by Inventor Paul N. Becker

Paul N. Becker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7660096
    Abstract: In a composite electrical circuit protection device, thermal coupling between a planar PPTC element and a planar MOV element is controlled by insertion of a thermal mass material for regulating heat transfer from the MOV element to the PPTC element, such that a PPTC resistor hot zone forms consistently away from the planar major foil electrode confronting the MOV thereby regulating heat transfer from the MOV to the PPTC resistor.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: February 9, 2010
    Assignee: Tyco Electronics Corporation
    Inventors: Boris Golubovic, Paul N. Becker, Robert P. Moore
  • Patent number: 7148785
    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: December 12, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
  • Patent number: 6987440
    Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 ?m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 ?m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 ?m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.
    Type: Grant
    Filed: July 11, 2003
    Date of Patent: January 17, 2006
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
  • Publication number: 20040218329
    Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5,7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion. The first attachment portion may contain a slot (49) and a solid hinge portion (51).
    Type: Application
    Filed: April 30, 2004
    Publication date: November 4, 2004
    Applicant: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Sirikhit Maniraj, Martin Pineda, Anthony Vranicar, Francis M. Yankello, Frank Wasilewski
  • Publication number: 20040104802
    Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 &mgr;m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 &mgr;m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 &mgr;m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.
    Type: Application
    Filed: July 11, 2003
    Publication date: June 3, 2004
    Inventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
  • Publication number: 20040006867
    Abstract: An electrical device (1) in which an element (7) composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode (3), the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer (11), and electrical devices using an adhesion promoting layer in combination with a crosslinking agent (9) are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.
    Type: Application
    Filed: January 3, 2003
    Publication date: January 15, 2004
    Inventors: Paul N. Becker, James A. Rinde, Barry C. Mathews, Orion Jankowski, Cecilia A. Walsh, Ryan W. Dupon
  • Patent number: 6593843
    Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being 0.5 to 1.6 &mgr;m. The conductive polymer composition preferably exhibits PTC behavior. In a second embodiment an electrical device has an element composed of a conductive polymer composition in contact with the first surface of a metal electrode produced by providing a base metal foil having an Ra of at most 0.45 &mgr;m and depositing material onto the base metal foil to form a first surface having a product of Ra times RD of at least 0.14 &mgr;m. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: July 15, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, Orion Jankowski, Cecilia A. Walsh
  • Patent number: 6531950
    Abstract: An electrical device in which an element composed of a conductive polymer composition is positioned in contact with the first surface of a metal electrode, the first surface having a center line average roughness Ra and a reflection density RD, the product Ra times RD being at least 0.06 &mgr;m, with an adhesion promoting layer positioned between the first surface of the metal electrode and the polymer element. The conductive polymer composition preferably exhibits PTC behavior. In other aspects, electrical devices using more than one adhesion promoting layer, and electrical devices using an adhesion promoting layer in combination with a crosslinking agent are provided. Other embodiments include electrical devices with metal electrodes made by pulse plating processes, and metal electrodes made by electrodeposition under diffusion-limited conditions. The electrical devices may be circuit protection devices and have improved electrical and physical properties.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: March 11, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Paul N. Becker, James A. Rinde, Barry C. Mathews, Orion Jankowski, Cecilia A. Walsh
  • Patent number: 4376217
    Abstract: This invention provides a general method for the conversion of alkenes to primary vicinal diamines by use of a cobalt alkylnitroso complex and reduction with lithium aluminum hydride.
    Type: Grant
    Filed: October 1, 1981
    Date of Patent: March 8, 1983
    Assignee: Regents of the University of California
    Inventors: Robert G. Bergman, Paul N. Becker, Mary A. White
  • Patent number: 4328164
    Abstract: This invention provides a general method for the conversion of alkenes to primary vicinal diamines by use of a cobalt alkylnitroso complex and reduction with lithium aluminum hydride.
    Type: Grant
    Filed: August 12, 1980
    Date of Patent: May 4, 1982
    Assignee: The Regents of the University of California
    Inventors: Robert G. Bergman, Paul N. Becker, Mary A. White