Patents by Inventor Paul Phong Nguyen
Paul Phong Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10310351Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.Type: GrantFiled: June 3, 2014Date of Patent: June 4, 2019Assignee: CLEARIST INC.Inventor: Paul Phong Nguyen
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Patent number: 9904137Abstract: A precursor solution adapted to provide a metal oxide film, includes: (a) at least one additive selected from a viscosity enhancer, a base, an acid and a wetting agent; (b) structural promoter ions selected from Mn, Ni, Co, Ir, Ru, Cr, Mo, W, Ta, Nb, V, Mo, Zr, V and Ti ions; and (c) at least one solvent. A method for preparing a metal oxide film includes: (a) providing a substrate; and (b) depositing on the substrate the precursor solution of the invention. Metal oxides films, electrochromic devices containing the films and methods for making them are also disclosed.Type: GrantFiled: August 21, 2014Date of Patent: February 27, 2018Assignee: Clearist, Inc.Inventors: Zhongchun Wang, Nelson R. Holcomb, Paul Phong Nguyen
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Patent number: 8932495Abstract: Embodiments of the invention generally provide hydrogen-doped and/or fluorine-doped transparent conducting oxide (TCO) materials and processes for forming such doped TCO materials. In one embodiment, a method for fabricating a doped TCO on a substrate surface includes forming a TCO material on a substrate, exposing the TCO material to a hydrogen plasma while forming a hydrogen-doped TCO material during an atmospheric pressure plasma (APP) process, wherein the hydrogen-doped TCO material contains atomic hydrogen at a concentration within a range from about 1 at % (atomic percent) to about 30 at %, and exposing the hydrogen-doped TCO material to a thermal annealing process. In another embodiment, the method includes exposing the TCO material to a fluorine plasma while forming a fluorine-doped TCO material during the APP process, wherein the fluorine-doped TCO material contains atomic fluorine at a concentration within a range from about 1 at % to about 30 at %.Type: GrantFiled: March 12, 2012Date of Patent: January 13, 2015Assignee: Clearist, Inc.Inventors: Paul Phong Nguyen, Scott Allen Jewhurst
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Publication number: 20140285866Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.Type: ApplicationFiled: June 3, 2014Publication date: September 25, 2014Inventor: Paul Phong NGUYEN
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Patent number: 8780432Abstract: Embodiments of the invention generally provide electrochromic devices and materials and processes for forming such electrochromic devices and materials. In one embodiment, an electrochromic device contains a lower transparent conductor layer disposed on a substrate, wherein an upper surface of the lower transparent conductor layer has a surface roughness of greater than 50 nm and a primary electrochromic layer having planarizing properties is disposed on the lower transparent conductor layer. The upper surface of the primary electrochromic layer has a surface roughness less than the surface roughness of upper surface of the lower transparent conductor layer, such as about 50 nm or less.Type: GrantFiled: March 22, 2012Date of Patent: July 15, 2014Inventor: Paul Phong Nguyen
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Patent number: 7313858Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: GrantFiled: March 31, 2004Date of Patent: January 1, 2008Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Patent number: 7304821Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: GrantFiled: November 19, 2003Date of Patent: December 4, 2007Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Patent number: 7079355Abstract: A method for producing a magnetic transducer with an inductive write head having a multilayer coil with a high aspect ratio and a short yoke is disclosed. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.Type: GrantFiled: March 29, 2004Date of Patent: July 18, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
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Patent number: 6901653Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: GrantFiled: April 2, 2002Date of Patent: June 7, 2005Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Patent number: 6876507Abstract: A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.Type: GrantFiled: January 18, 2002Date of Patent: April 5, 2005Assignee: International Business Machines CorporationInventors: Mike Ming Yu Chen, Thomas Edward Dinan, Paul Phong Nguyen, Neil Leslie Robertson
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Patent number: 6804879Abstract: A method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke is provided. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.Type: GrantFiled: October 23, 2002Date of Patent: October 19, 2004Assignee: Hitachi Global Storage Technologies Netherlands, B.V.Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
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Publication number: 20040190196Abstract: Applicants disclose a method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.Type: ApplicationFiled: March 29, 2004Publication date: September 30, 2004Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
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Publication number: 20040177493Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: ApplicationFiled: March 31, 2004Publication date: September 16, 2004Inventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Publication number: 20040080866Abstract: Applicants disclose a method for producing a magnetic transducer with a inductive write head having a multilayer coil with a high aspect ratio and a short yoke. A damascene process is used for two coil layers and a conventional process for the third coil layer. The process of the invention allows a seed layer for the coil to be deposited on the side walls of the trenches for the first and second coil layers. In one embodiment the seed layer for the coil is preceded by an adhesion layer.Type: ApplicationFiled: October 23, 2002Publication date: April 29, 2004Inventors: Richard D. Hsiao, Quang Le, Edward Hin Pong Lee, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Bradley Douglas Webb, Patrick Rush Webb, Samuel Wei-san Yuan
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Publication number: 20040075938Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: ApplicationFiled: November 19, 2003Publication date: April 22, 2004Applicant: HITACHI GLOBAL STORAGE TECHNOLOGIESInventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Publication number: 20030184912Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.Type: ApplicationFiled: April 2, 2002Publication date: October 2, 2003Applicant: INTERNATIONAL BUSINESS MACHINESInventors: Richard Hsiao, Prakash Kasiraj, Quang Le, Paul Phong Nguyen, Son Van Nguyen, Denny D. Tang, Patrick Rush Webb
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Publication number: 20030137767Abstract: A thin-film write head employing pole pieces formed of an electroplated body-centered cubic (BCC) nickel-iron alloy with a saturation flux density (BS) of 1.9 to 2.3 T (19 to 23 kG) and an acceptable coercivity (HC) of about 80 to about 160 A/m (1-2 Oe). The iron content of the electroplated nickel-iron alloy is from 64% to 81% by weight. The two-layer pole fabrication process holds magnetic anisotropy and coercivity to useable values while improving saturation flux density and optimizing magnetostriction. This is accomplished by first electroplating a BCC nickel-iron layer onto an underlying seed layer and then annealing the two layers to reduce coercivity to less than about 160 amps/meter and raise magnetization to acceptable levels.Type: ApplicationFiled: January 18, 2002Publication date: July 24, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Mike Ming Yu Chen, Thomas Edward Dinan, Paul Phong Nguyen, Neil Leslie Robertson