Abstract: A process for making glass sheet with low compaction suitable for high temperature applications, such as low-temperature polysilicon-based TFT displays, and glass sheets thus made. The glass sheet desirably has an anneal point of at least 765° C., a CTE at most 42×10?7/° C. The process involves cooling the glass melt form a temperature corresponding to a viscosity of 1.0×1010 poise to a temperature corresponding to a viscosity of 1.0×1015 poise at a cooling rate CR, where CR?5° C./second. The absolute value of the measured compaction of the glass sheet desirably is at most 175 ppm upon being re-heated to 675° C. for a period of time.

Abstract: A rare-earth-containing glass material having a composition, expressed in mole percentages on and oxide basis, comprising: SiO2: 66-75 Al2O3: 11-17 B2O3: 0-4 MgO: 1-6.5 CaO: 2-7 SrO: 0-4 BaO: 0-4 Y2O3: 0-4 La2O3: 0-4 Y2O3+La2O3: 0.1-4. The inclusion of Y2O3 and/or La2O3 in the composition reduces the T2.3 of the glass thereby allowing higher annealing-point glasses to be produced. The glass is particularly useful for low-temperature polycrystalline silicon-based semiconductor devices.

Abstract: A semiconductor-on-insulator structure including first and second layers which are attached to one another either directly or through one or more intermediate layers. The first layer includes a substantially single crystal germanium semiconductor material while the second layer comprises a glass or a glass-ceramic material having a linear coefficient thermal of expansion (25-300° C.) which is within the range of +/?20×10?7/° C. of the linear coefficient thermal of expansion of the germanium first layer.

Abstract: A method is disclosed for sealing a plurality of glass articles, comprising providing a first glass article comprising at least one first sealing surface, wherein the at least one first sealing surface comprises a glass comprising a copper compound, and optionally a silver compound, positioned within a portion of the glass of the first glass article; providing a second glass article comprising at least one second sealing surface; contacting at least a portion of the first sealing surface with at least a portion of the second sealing surface; and irradiating at least a portion of the first sealing surface in a manner that causes at least a portion of the first glass article and at least a portion of the second glass article to be sealed together. A fused device is also disclosed.

Abstract: A frit composition useful for sealing a light emitting device is disclosed. The frit composition comprises a glass portion comprising a base component and at least one absorbing component. The glass portion of the frit comprises silica, boron oxide, optionally alumina, and (a) cupric oxide and/or a (b) combination of ferric oxide, vanadium pentoxide, and optionally titanium dioxide. Also disclosed is an article comprising a substrate and a frit, and a glass package comprising two substrates and a frit positioned between the substrates. A method for manufacturing a hermetically sealed glass package comprising the deposition of a glass frit and heating of the glass frit to form a hermetic seal is also disclosed.