Patents by Inventor Paul Thomas Adair

Paul Thomas Adair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vehicle lighting apparatus with chip scale package
    Patent number: 11796136
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: October 24, 2023
    Assignee: Putco, Inc.
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • Led headlight kit having filament and pressured chamber
    Patent number: 11708945
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: July 25, 2023
    Assignee: Putco, Inc.
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • LED HEADLIGHT KIT HAVING FILAMENT AND PRESSURED CHAMBER
    Publication number: 20230160542
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Application
    Filed: September 28, 2022
    Publication date: May 25, 2023
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • HEAT DISSIPATION DEVICE FOR VEHICLE HEAD LAMPS AND FOG LAMPS
    Publication number: 20230160543
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Application
    Filed: September 28, 2022
    Publication date: May 25, 2023
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • VEHICLE LIGHTING APPARATUS WITH CHIP SCALE PACKAGE
    Publication number: 20230160544
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Application
    Filed: September 28, 2022
    Publication date: May 25, 2023
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • Heat dissipation device for vehicle head lamps and fog lamps
    Patent number: 11655943
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: May 23, 2023
    Assignee: Putco, Inc.
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell
  • Replacement vehicle lighting apparatus
    Patent number: 11499681
    Abstract: A replacement lighting apparatus for automobiles is slim and includes an industry-leading footprint to fit into modern headlamps' minimal housing space. The lighting apparatus employs chip scale package light emitting diodes (CSP LEDs), flexible metal heat sinks, an improved collar having a watertight seal formed with an elastomeric gasket and the use of at least one, if not multiple, set screws, a wire harness with a nylon braided sleeve, and a solid-state design for maximum performance, long life, and superior scientifically proven heat mitigation.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: November 15, 2022
    Assignee: Putco, Inc.
    Inventors: Conner Schramm, Parker Freeman, Seth Hoogendoorn, Nicholas Niemeyer, Paul Thomas Adair, James P. Elwell