Abstract: An embodiment method for operating a device includes determining, based on data collected by a first sensor, first information between the first sensor and an object; determining, based on data collected by a second sensor, second information between the second sensor and the object; and determining a distance between the device and the object based on comparing the first information and the second information.

Abstract: A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable.

Abstract: An autofocus method determines that a ranging device of a digital camera has failed in an attempt to provide a distance estimation. The ranging device provides one or more parameters indicating conditions related to the failure of the ranging device to provide the distance estimation. An autofocus sequence based on the one or more parameters is then performed.

Abstract: An autofocus method determines that a ranging device of a digital camera has failed in an attempt to provide a distance estimation. The ranging device provides one or more parameters indicating conditions related to the failure of the ranging device to provide the distance estimation. An autofocus sequence based on the one or more parameters is then performed.

Abstract: The disclosure relates to a test process of an image stabilization system in an image capture apparatus, comprising steps of: submitting the stabilization system to rotation vibratory movements around two distinct rotation axes, measuring characteristics of rotation vibratory movements, and setting the rotation vibratory movements to setpoint position values and, taking into consideration the measured characteristics of the vibratory movements, collecting images from the image capture apparatus submitted to vibration and analyzing the collected images.

Abstract: A method and a circuit for controlling a dynamic image sensor defining, for each image, several successive time intervals of exposure of photodiode cells, starting from successive decreasing reset levels, wherein the time intervals of exposure of the image respect a homogeneous distribution of the amount of cells in ranges of brightness levels.

Abstract: The disclosure relates to a test process of an image stabilization system in an image capture apparatus, comprising steps of: submitting the stabilization system to rotation vibratory movements around two distinct rotation axes, measuring characteristics of rotation vibratory movements, and setting the rotation vibratory movements to setpoint position values and, taking into consideration the measured characteristics of the vibratory movements, collecting images from the image capture apparatus submitted to vibration and analyzing the collected images.

Abstract: A method and a circuit for controlling a dynamic image sensor defining, for each image, several successive time intervals of exposure of photodiode cells, starting from successive decreasing reset levels, wherein the time intervals of exposure of the image respect a homogeneous distribution of the amount of cells in ranges of brightness levels.

Abstract: A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable.