Abstract: Devices, systems and methods for removing heat from subcutaneously disposed lipid-rich cells are disclosed. In selected embodiments, suction and/or heat removal sources are coupled to an applicator. The applicator includes a flexible portion and a rigid portion. The rigid portion includes a thermally conductive plate and a frame coupling the thermally conductive plate and the flexible portion. An interior cavity of the applicator is in fluid communication with the suction source, and the frame maintains contiguous engagement between the heat removal source and the thermally conductive plate.

Abstract: Packages or arrays comprising a plurality of sanitary tissue product sheets. One or more subsets of the plurality of sanitary tissue product sheets may be surrounded by a band. Each subset may be sized to provide a suitable refill for a dispenser. The sanitary tissue product sheets may be bi-folded and a free end of a first sanitary tissue product sheet of the sanitary tissue product sheets may be nested within a bifold of a second sanitary tissue product sheet of the sanitary tissue product sheets. The package or array may include in an outer container, such as a cardboard box or a plastic film.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can comprise: providing a carrier substrate; providing an adhesion modification layer over the carrier substrate; providing a device substrate; and coupling the device substrate and the carrier substrate together, the adhesion modification layer being located between the device substrate and the carrier substrate when the device substrate and the carrier substrate are coupled together. In these embodiments, the adhesion modification layer can be configured so that the device substrate couples indirectly with the carrier substrate by way of the adhesion modification layer with a first bonding force that is greater than a second bonding force by which the device substrate couples with the carrier substrate absent the adhesion modification layer. Other embodiments of related methods and devices are also disclosed.

Abstract: Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.

Abstract: A neural network process for improving wind retrievals from wind profiler measurements is described. In this invention, a neural network is trained to retrieve (missing or incomplete) upper level winds from ground based wind profiler measurements. Radiosonde measurements in conjunction with wind profiler ground measurements for specific geographical locations are used as training sets for the neural network. The idea is to retrieve timely and spatially continuous upper level wind information from (fragmented or incomplete) wind profiler measurements.

Abstract: Apparatus and methods configure digital predistortion linearizers for power amplification of bandlimited signals using non-linear amplifiers. The predistorter is configured to achieve both crest factor reduction (CFR) and predistortion for linearization. One embodiment advantageously reduces processing requirements conventionally associated with CFR by considering only the in-band component, that is, the information bearing component, of the desired signal to be reproduced for those cases in which the mitigation of in-band error vector magnitude (EVM) is preferred over the reduction of spurious out-of-band emissions.

Abstract: A neural network process for improving wind retrievals from wind profiler measurements is described. In this invention, a neural network is trained to retrieve (missing or incomplete) upper level winds from ground based wind profiler measurements. Radiosonde measurements in conjunction with wind profiler ground measurements for specific geographical locations are used as training sets for the neural network. The idea is to retrieve timely and spatially continuous upper level wind information from (fragmented or incomplete) wind profiler measurements.

Abstract: A neural network process for improving wind retrievals from wind profiler measurements is described. In this invention, a neural network is trained to retrieve missing or incomplete upper level winds from ground based wind profiler measurements. Radiosonde measurements in conjunction with wind profiler ground measurements for specific geographical locations are used as training sets for the neural network. The idea is to retrieve timely and spatially continuous upper level wind information from fragmented or incomplete wind profiler measurements.