Abstract: A depth measuring apparatus includes (1) a camera and lens assembly that captures image data for a sequence of images of a target including a plurality of depth levels; (2) a motion stage on which the camera and lens assembly or the target is positioned; (3) a motor connected to the motion stage that causes relative movement between the camera and lens assembly and the target at defined incremental values; (4) a position sensor that captures position data on the camera and lens assembly or the target at each of the defined incremental values; and (5) a controller that processes the captured image data and captured position data using an image gradient method and optimal focal distance to determine depths of the plurality of depth levels. Numerous other aspects are provided.

Abstract: A dual-blade robot having overlapping frog-leg linkages is disclosed. The robot includes first and second arms, coplanar with each other and each rotatably coupled to a first blade, in a frog-leg configuration, and third and fourth arms, coplanar with each other and each rotatably coupled to a second blade, in a frog-leg configuration, where the third and fourth arms are vertically offset from the first and second arms. The third and fourth arms are configured to overlap at least a portion of the first and second arms when the first and second blades are in a retracted position. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: A dual-blade robot having overlapping frog-leg linkages is disclosed. The robot includes first and second arms, coplanar with each other and each rotatably coupled to a first blade, in a frog-leg configuration, and third and fourth arms, coplanar with each other and each rotatably coupled to a second blade, in a frog-leg configuration, where the third and fourth arms are vertically offset from the first and second arms. The third and fourth arms are configured to overlap at least a portion of the first and second arms when the first and second blades are in a retracted position. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: A robot assembly allowing remote actuation of a carriage supported robot. The robot assembly includes a track, a carriage moveable along the track, and a robot mounted to the carriage. The robot includes at least a first arm, and a first driven member coupled to the first arm. The robot assembly further includes a drive assembly having a first driving member, a first transmission member coupled to the first driving member and the first driven member, and a first drive motor coupled to the first driving member. The first drive motor is configured to move the first driving member causing remote rotation of the first driven member and rotation of the first arm. Substrate processing apparatus and methods of transporting a substrate within a substrate processing apparatus are also provided, as are numerous other aspects.

Abstract: A robot assembly allowing remote actuation of a carriage supported robot. The robot assembly includes a track, a carriage moveable along the track, and a robot mounted to the carriage. The robot includes at least a first arm, and a first driven member coupled to the first arm. The robot assembly further includes a drive assembly having a first driving member, a first transmission member coupled to the first driving member and the first driven member, and a first drive motor coupled to the first driving member. The first drive motor is configured to move the first driving member causing remote rotation of the first driven member and rotation of the first arm. Substrate processing apparatus and methods of transporting a substrate within a substrate processing apparatus are also provided, as are numerous other aspects.

Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.

Abstract: A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading tracks. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. One or more process robots in a process module move wafers from buffers, or other locations, to processors in the process module.

Abstract: A wafer loading system accommodates sufficient wafer carriers to substantially maximize the processing speed capability of wafer processing systems. Wafer carriers are placed into and removed from the loading system by one or two overhead carrier loading elements, such as overhead track systems. Carriers may be loaded or removed while other carriers are in work. One or more transfer robots may move wafers from the carriers to buffers. Methods of operating the loading system allow delivery and removal of wafers to and from the processing systems to meet or exceed the processing speeds of the processing systems.

Abstract: A thermal processor is adapted for annealing substrates. The processor has a sealed process chamber. Air is excluded from the process chamber during processing to avoid oxidation of substrate surfaces, such as copper surfaces. The substrate temperature is controlled by selectively positioning the substrate between a hot plate and a cold plate operating at steady state conditions. During loading and/or unloading, the air flow is induced over the substrate. This keeps the substrate at a temperature low enough to avoid oxidation, even though the heater may remain on.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process head lifter lowers the head holding the workpiece into the processing fluid in the bowl. Sonic energy is provided to the workpiece through the processing fluid, optionally while the processing head spins the workpiece. The processing fluid may include de-ionized water and an etchant.

Abstract: A system for processing wafers includes a robot moveable within an enclosure to load and unload workpieces into and out of workpiece processors. A processor includes an upper rotor having alignment pins, and a lower rotor having one or more openings for receiving the alignment pins to form a processing chamber around the workpiece. The alignment pins center the workpiece relative to a rotor spin axis and to an etch or drain groove in the upper rotor. A first fluid outlet delivers processing fluid to a central region of the workpiece. The processing fluid is distributed across the workpiece surface via centrifugal force generated by spinning the processing chamber. Purge gas is optionally delivered into the processing chamber through an annular opening around the first fluid outlet to help remove processing fluid from the processing chamber.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.

Abstract: A system for processing wafers includes a robot moveable within an enclosure to load and unload workpieces into and out of workpiece processors. A processor includes an upper rotor having alignment pins, and a lower rotor having one or more openings for receiving the alignment pins to form a processing chamber around the workpiece. The alignment pins center the workpiece relative to a rotor spin axis and to an etch or drain groove in the upper rotor. A first fluid outlet delivers processing fluid to a central region of the workpiece. The processing fluid is distributed across the workpiece surface via centrifugal force generated by spinning the processing chamber. Purge gas is optionally delivered into the processing chamber through an annular opening around the first fluid outlet to help remove processing fluid from the processing chamber.

Abstract: A system and method for processing a workpiece, includes workpiece processors. A robot is moveable within an enclosure to load and unload workpieces into and out of the processors. A processor includes an upper rotor having a central air flow opening. The upper rotor is magnetically driven into engagement with a lower rotor to form a workpiece processing chamber. A moveable drain mechanism aligns different drain paths with the processing chamber so that different processing fluids may be removed from the processing chamber via different drain paths. A moveable nozzle positioned in the air flow opening distributes processing fluid to the workpiece. The processing fluid is distributed across the workpiece surface, via centrifugal force generated by spinning the processing chamber, and removed from the processing chamber via the moveable drain mechanism.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.

Abstract: A system for processing a workpiece includes a head attached to a head lifter. A workpiece is supported in the head between an upper rotor and a lower rotor. A base has a bowl for containing a liquid. The head is movable by the head lifter from a first position vertically above the bowl, to a second position where the workpiece is at least partially positioned in the bowl. The bowl has a contour section with a sidewall having a radius of curvature which increases adjacent to a drain outlet in the bowl, to help rapid draining of liquid from the bowl. The head has a load position, where the rotors are spaced apart by a first amount, and a process position, where the rotors are engaged and sealed against each other. For rapid evacuation of fluid, the head also has a fast drain position, where the rotors are moved apart sufficiently to create an annular drain gap.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.