Abstract: A three-axis magnetic sensor or magnetometer is provided. Two magnetic sensor Wheatstone bridges using barber pole AMR structures are fabricated on opposite sides of a bump structure formed on a substrate to provide surfaces that are at a predetermined angle with respect to the flat surface of the substrate. The bridge assembly is oriented along the Y axis and the bridges are interconnected such that Y and Z channel signals can be produced by processing of the bridge signals. The X channel signals are provided by an X axis sensor provided on the level surface of the substrate.

Abstract: A three-axis magnetic sensor or magnetometer is provided. Two magnetic sensor Wheatstone bridges using barber pole AMR structures are fabricated on opposite sides of a bump structure formed on a substrate to provide surfaces that are at a pre-determined angle with respect to the flat surface of the substrate. The bridge assembly is oriented along the Y axis and the bridges are interconnected such that Y and Z channel signals can be produced by processing of the bridge signals. The X channel signals are provided by an X axis sensor provided on the level surface of the substrate.

Abstract: An optical system for a head mounted display includes a light pipe having two parallel surfaces along which modes can travel by total internal reflection. An illumination element allows selection of modes so that the desired modes can be transmitted along the light pipe, either axially or by total internal reflection.

Abstract: A method for producing a solid optical system with embedded elements is provided. The embedded elements may include inorganic, polymer, or hybrid lenses, mirrors, beam splitters and polarizers, or other elements. The embedding material is a transparent high quality optical polymer.

Abstract: A casting method, rather than injection molding, to produce polymer optical components and systems is provided. The casting process controls shrinkage and stress, thus providing both high bulk uniformity and high quality, accurate surfaces, by incorporating polymer films into the mold. The films may remain incorporated into the part or may optionally be removed from the part after removal from the mold. In addition, the incorporation of separately produced components within the cast part is also provided, eliminating post-casting assembly manufacturing steps.

Abstract: A binocular viewing system provides images from electronic display elements to the left and right eyes of a user transmitted via right eye and left eye display assemblies connected by a nose bridging element. The binocular viewing system includes an interpupillary distance adjustment mechanism to accommodate multiple users. Accommodation for vision correction and a focus mechanism may also be provided. Component parts can be formed integrally. A source of image date is communication with the electronic display elements includes a television, a digital video disc player, an MPEG4 player, a camcorder, a digital camera, a video tape player, a personal computer, a personal digital assistant, or a cellular telephone.

Abstract: An ophthalmic lens contains inserts (26, 28) for projecting an image towards the user's eye. The lens is treated by coating the surface order to attenuate light reflected on the treated surface from the inside of the lens. Coating the surface of the lens attenuates the parasitic images formed by rays reflected on the coated surface and projected by the insert.

Abstract: An ophthalmic lens contains inserts (26, 28) for projecting an image towards the user's eye. The lens is treated by coating the surface order to attenuate light reflected on the treated surface from the inside of the lens. Coating the surface of the lens attenuates the parasitic images formed by rays reflected on the coated surface and projected by the insert.

Abstract: A method for the fabrication complex-transition metal oxide (CTMO)/semiconductor or dielectric substrate integrated devices includes the separation of the CTMO film growth process from the CTMO-film/semiconductor or dielectric substrate integration process. The CTMO-film is transferred from the native substrate to the final substrate for fabrication into devices. The CTMO-film is grown onto a native substrate under growth conditions chosen to provide a CTMO-film having desirable properties and thickness. No restrictions are placed upon the native substrate used, the growth method used, or on the growth conditions required. The CTMO-film is then joined to the semiconductor or dielectric substrate and the native substrate is removed, providing the basis for an integrated electronics, photonics, or MEMS device. Techniques fully compatible with semiconductor processing can be used to fabricate monolithically integrated CTMO/semiconductor devices in a first embodiment.