Patents by Inventor Pavel Kolchin
Pavel Kolchin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10887580Abstract: Methods and systems for improved detection and classification of defects of interest (DOI) on semiconductor wafers based on three-dimensional images are described herein. Three dimensional imaging of volumes of thick, layered structures enables accurate defect detection and estimation of defect location in three dimensions at high throughput. A series of images are acquired at a number of different wafer depths. A three dimensional image of a thick semiconductor structure is generated from the series of images. Defects are identified and classified based on an analysis of the three dimensional image of the thick semiconductor structure. In some examples, the three-dimensional image stack is visualized by contour plots or cross-sectional plots to identify a characteristic defect response. In some examples, the three-dimensional image is processed algorithmically to identify and classify defects. In another aspect, the location of a defect is estimated in three dimensions based on the three dimensional image.Type: GrantFiled: August 22, 2017Date of Patent: January 5, 2021Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Robert M. Danen, Philip Measor
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Patent number: 10571407Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.Type: GrantFiled: May 1, 2019Date of Patent: February 25, 2020Assignee: KLA-Tencor Corp.Inventors: Stefano Palomba, Pavel Kolchin, Mikhail Haurylau, Robert M. Danen, David W. Shortt
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Publication number: 20190257768Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.Type: ApplicationFiled: May 1, 2019Publication date: August 22, 2019Inventors: Stefano Palomba, Pavel Kolchin, Mikhail Haurylau, Robert M. Danen, David W. Shortt
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Patent number: 10317347Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.Type: GrantFiled: October 9, 2014Date of Patent: June 11, 2019Assignee: KLA-Tencor Corp.Inventors: Stefano Palomba, Pavel Kolchin, Mikhail Haurylau, Robert M. Danen, David W. Shortt
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Patent number: 10215713Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).Type: GrantFiled: June 18, 2017Date of Patent: February 26, 2019Assignee: KLA-Tencor Corp.Inventors: Pavel Kolchin, Mikhail Haurylau, Junwei Wei, Dan Kapp, Robert Danen, Grace Chen
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Patent number: 10132760Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.Type: GrantFiled: July 6, 2017Date of Patent: November 20, 2018Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Patent number: 9989479Abstract: A computer-based apparatus for adjusting an auto-focus in a wafer inspection system, including: a wafer adjustment system; and an electronic feedback loop system configured to compare an intensity of a first light beam rotating in a first spiral about a first central axis, and when the intensity is less than a preselected threshold, adjust, using the wafer adjustment system, a position of the wafer until the intensity reaches the preselected threshold.Type: GrantFiled: June 13, 2016Date of Patent: June 5, 2018Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Mikhail Haurylau, Robert Danen
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Publication number: 20180103247Abstract: Methods and systems for improved detection and classification of defects of interest (DOI) on semiconductor wafers based on three-dimensional images are described herein. Three dimensional imaging of volumes of thick, layered structures enables accurate defect detection and estimation of defect location in three dimensions at high throughput. A series of images are acquired at a number of different wafer depths. A three dimensional image of a thick semiconductor structure is generated from the series of images. Defects are identified and classified based on an analysis of the three dimensional image of the thick semiconductor structure. In some examples, the three-dimensional image stack is visualized by contour plots or cross-sectional plots to identify a characteristic defect response. In some examples, the three-dimensional image is processed algorithmically to identify and classify defects. In another aspect, the location of a defect is estimated in three dimensions based on the three dimensional image.Type: ApplicationFiled: August 22, 2017Publication date: April 12, 2018Inventors: Pavel Kolchin, Robert M. Danen, Philip Measor
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Publication number: 20170307545Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.Type: ApplicationFiled: July 6, 2017Publication date: October 26, 2017Applicant: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Publication number: 20170292918Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).Type: ApplicationFiled: June 18, 2017Publication date: October 12, 2017Inventors: Pavel Kolchin, Mikhail Haurylau, Junwei Wei, Dan Kapp, Robert Danen, Grace Chen
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Patent number: 9734422Abstract: Enhanced defect detection of a sample includes acquiring two or more inspection images from a sample from two or more locations of the sample for a first optical mode. The defect detection also generates an aggregated defect profile based on the two or more inspection images from the two or more locations for the first optical mode for a selected defect type and calculating one or more noise correlation characteristics of the two or more inspection images acquired from the two or more locations for the first optical mode. Defect detection further includes the generation of a matched filter for the first optical mode based on the generated aggregated defect profile and the calculated one or more noise correlation characteristics.Type: GrantFiled: November 10, 2015Date of Patent: August 15, 2017Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Eugene Shifrin
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Patent number: 9726617Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.Type: GrantFiled: November 8, 2013Date of Patent: August 8, 2017Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Patent number: 9709510Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).Type: GrantFiled: June 24, 2015Date of Patent: July 18, 2017Assignee: KLA-Tencor Corp.Inventors: Pavel Kolchin, Mikhail Haurylau, Junwei Wei, Dan Kapp, Robert Danen, Grace Chen
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Patent number: 9389349Abstract: A computer-based method for inspecting a wafer, including: storing, in a memory element for at least one computer, computer readable instructions; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size.Type: GrantFiled: March 15, 2013Date of Patent: July 12, 2016Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Mikhail Haurylau, Robert Danen
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Publication number: 20160140412Abstract: Enhanced defect detection of a sample includes acquiring two or more inspection images from a sample from two or more locations of the sample for a first optical mode. The defection detection also generating an aggregated defect profile based on the two or more inspection images from the two or more locations for the first optical mode for a selected defect type and calculating one or more noise correlation characteristics of the two or more inspection images acquired from the two or more locations for the first optical mode. Defect detection further includes the generation of a matched filter for the first optical mode based on the generated aggregated defect profile and the calculated one or more noise correlation characteristics.Type: ApplicationFiled: November 10, 2015Publication date: May 19, 2016Inventors: Pavel Kolchin, Eugene Shifrin
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Publication number: 20150377797Abstract: Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for constructing additional image(s) from two or more of the different images, and the two or more different images used to generate any one of the additional image(s) do not include only different images generated for single collection apertures in the set. The computer subsystem is further configured for selecting one of the different or additional configurations for the optical element based on the different images and the additional image(s).Type: ApplicationFiled: June 24, 2015Publication date: December 31, 2015Inventors: Pavel Kolchin, Mikhail Haurylau, Junwei Wei, Dan Kapp, Robert Danen, Grace Chen
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Publication number: 20150123014Abstract: Systems and methods for determining information for defects on a wafer are provided. One system includes an illumination subsystem configured to direct light having one or more illumination wavelengths to a wafer. The one or more illumination wavelengths are selected to cause fluorescence from one or more materials on the wafer without causing fluorescence from one or more other materials on the wafer. The system also includes a detection subsystem configured to detect only the fluorescence from the one or more materials or to detect non-fluorescent light from the wafer without detecting the fluorescence from the one or more materials. In addition, the system includes a computer subsystem configured to determine information for defects on the wafer using output generated by the detection subsystem responsive to the detected fluorescence or the detected non-fluorescent light.Type: ApplicationFiled: October 9, 2014Publication date: May 7, 2015Inventors: Stefano Palomba, Pavel Kolchin, Mikhail Haurylau, Robert M. Danen, David W. Shortt
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Publication number: 20140354983Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.Type: ApplicationFiled: November 8, 2013Publication date: December 4, 2014Applicant: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus b. Huber, Robert M. Danen