Abstract: A source follower method, system, and apparatus provide rail-to-rail capability to an output voltage terminal of a voltage follower feedback biased CMOS output circuit by providing a control circuit which includes first and second bypass transistors that are connected in parallel between first and second control circuit input/output terminals and controlled, respectively, by first and second control circuit inputs, and which also includes first and second current sources for injecting source and sink currents in the output node as a function, respectively, of a first bypass current through the first bypass transistor which turns ON when the output voltage rises above a top threshold voltage level and of a second bypass current through the second bypass transistor which turns ON when the output voltage falls below a bottom threshold voltage level.

Abstract: A source follower method, system, and apparatus provide rail-to-rail capability to an output voltage terminal of a voltage follower feedback biased CMOS output circuit by providing a control circuit which includes first and second bypass transistors that are connected in parallel between first and second control circuit input/output terminals and controlled, respectively, by first and second control circuit inputs, and which also includes first and second current sources for injecting source and sink currents in the output node as a function, respectively, of a first bypass current through the first bypass transistor which turns ON when the output voltage rises above a top threshold voltage level and of a second bypass current through the second bypass transistor which turns ON when the output voltage falls below a bottom threshold voltage level.

Abstract: A die temperature measurement system (300) includes an external test environment setup (352) and an integrated circuit (302). The external test environment setup (352) includes means to force and accurately measure electrical variables. The integrated circuit (302) includes a bipolar transistor (325); a selectable switch (340) for selecting from plurality of integrated resistances (342, 344) to be coupled in series between a base (322) of the bipolar transistor and a first input (362); and a selectable-gain current mirror (310) with a gain, a programmable current-mirror output coupled to the collector (326) of the bipolar transistor. The bipolar transistor and optional diodes (335) are sequentially biased with a set of proportional collector current levels. For each bias condition, the temperature-dependent voltage produced by the structure is extracted and stored. Die temperature is obtained through algebraic manipulation (450) of this data. Parasitic resistance and I/O pad leakage effects are canceled.

Abstract: A die temperature measurement system (300) includes an external test environment setup (352) and an integrated circuit (302). The external test environment setup (352) includes means to force and accurately measure electrical variables. The integrated circuit (302) includes a bipolar transistor (325); a selectable switch (340) for selecting from plurality of integrated resistances (342, 344) to be coupled in series between a base (322) of the bipolar transistor and a first input (362); and a selectable-gain current mirror (310) with a gain, a programmable current-mirror output coupled to the collector (326) of the bipolar transistor. The bipolar transistor and optional diodes (335) are sequentially biased with a set of proportional collector current levels. For each bias condition, the temperature-dependent voltage produced by the structure is extracted and stored. Die temperature is obtained through algebraic manipulation (450) of this data. Parasitic resistance and I/O pad leakage effects are canceled.

Abstract: A die temperature measurement system (300) includes an external test environment setup (352) and an integrated circuit (302). The external test environment setup (352) includes means to force and accurately measure electrical variables. The integrated circuit (302) includes a bipolar transistor (325); a selectable switch (340) for selecting from plurality of integrated resistances (342, 344) to be coupled in series between a base (322) of the bipolar transistor and a first input (362); and a selectable-gain current mirror (310) with a gain, a programmable current-mirror output coupled to the collector (326) of the bipolar transistor. The bipolar transistor and optional diodes (335) are sequentially biased with a set of proportional collector current levels. For each bias condition, the temperature-dependent voltage produced by the structure is extracted and stored. Die temperature is obtained through algebraic manipulation (450) of this data. Parasitic resistance and I/O pad leakage effects are canceled.