Patents by Inventor Pei Cheh Chen

Pei Cheh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for increasing uniformity in ion mill process
    Patent number: 7846305
    Abstract: A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: December 7, 2010
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: Pei Cheh Chen, Omar Eduardo Montero Camacho, Laurence Scott Samuelson, Yongjian Sun
  • High adhesion performance roll sputtered strike layer
    Patent number: 6337004
    Abstract: The adhesion of chromium-copper layer to polyimide has been greatly improved by a method which provides controlled reduction, rather than total elimination, of water content in the polyimide. The electronic packaging device which incorporates the flexible circuit prepared by the method exhibits greatly improved reliability. It is believed that the invention can be used to improve the adhesion between other organic materials having moisture affinity and materials comprising in-organics or between two organic materials.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: January 8, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kim Joseph Blackwell, Pei Cheh Chen, Frank Daniel Egitto, Allan Robert Knoll, George Joseph Matarese, Luis Jesus Matienzo
  • Process for coating a substrate with metallic layer
    Patent number: 6235411
    Abstract: A metallic layer is coated onto a polyimide substrate by sputtering a layer of chromium followed by a layer of copper whereby the rate of deposition of the chromium is about 4 angstroms/second or less.
    Type: Grant
    Filed: June 28, 1994
    Date of Patent: May 22, 2001
    Assignee: International Business Machines Corporation
    Inventors: Kim Joseph Blackwell, Pei Cheh Chen, Allan Robert Knoll, Luis Jesus Matienzo, Richard Dean Weale