Abstract: A light switchable device is provided. The light switchable device includes a first conductive layer, a second conductive layer disposed opposite the first conductive layer, and a sealant layer disposed between the first conductive layer and the second conductive layer. The first conductive layer, the second conductive layer, and the sealant layer form a closed space. The light switchable device also includes a light switchable layer disposed in the closed space, wherein the light switchable layer includes a plurality of alignment structures and polymer-stabilized liquid crystals (PSLC). The plurality of alignment structures is disposed on the first conductive layer or the second conductive layer, and the PSLC's are distributed between the plurality of alignment structures. A height of the plurality of alignment structures is less than a height of the sealant layer, and greater than or equal to 5% of the height of the sealant layer.

Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.

Abstract: A resin composition is provided, which includes an oligomer formed by reacting bisphenol epoxy resin monomer, aliphatic diglycidyl ether, anhydride compound, and catalyst, wherein the molar ratio of epoxy groups of the bisphenol epoxy resin monomer and aliphatic diglycidyl ether to anhydride groups of the anhydride compound is between 3.5:1 and 8.8:1. The bisphenol epoxy resin monomer and aliphatic diglycidyl ether have a molar ratio of 0.3:1 to 1.3:1, and the viscosity of the resin composition is 20 Pa·s to 80 Pa·s at 25° C.