Patents by Inventor Pei-Ti Lin

Pei-Ti Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178102
    Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 30, 2024
    Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 9718247
    Abstract: A method for fabricating a bubbler is disclosed, which is performed by laminating a polypropylene (PP), PE, CPET film onto a paper material surface to form a PP, PE, CPET film, and then screen printing or coating a hydrophilic polyurethane (PU) material onto another surface of the paper material to form a hydrophilic PU foaming material, then color printing a print material onto the hydrophilic foaming film to form a pattern layer, trimming the paper material to form a paper plate having a desired range, and forming the paper plate as an utensil, and enabling the hydrophilic PU foaming film to form a three dimensional pattern area on a surface of the utensil by being heated and thus foaming with a heating temperature presenting when the utensil is formed, whereby a three dimensional pattern area may be directly formed onto a surface of a utensil.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: August 1, 2017
    Inventor: Pei-Ti Lin
  • Publication number: 20160327339
    Abstract: A foaming paper cup heating structure is disclosed, which comprises a heating mechanism, comprising a cavity, and a plurality of heating units disposed within the cavity; and a pick-up and place mechanism, disposed corresponding to the heating units within the cavity. As such, a pick-up and place mechanism is used to grip a plurality of paper cups coated a foaming material thereon, the foaming material is continuously heated within the heating mechanism to foam to present a form, so that the paper cup may achieve the efficacies of a rapid heating, a uniform heating, a rapid producing, and an enhanced production yield.
    Type: Application
    Filed: May 7, 2015
    Publication date: November 10, 2016
    Inventor: Pei-Ti Lin
  • Publication number: 20160288443
    Abstract: A method for fabricating a bubbler is disclosed, which is performed by laminating a polypropylene (PP), PE, CPET film onto a paper material surface to form a PP, PE, CPET film, and then screen printing or coating a hydrophilic polyurethane (PU) material onto another surface of the paper material to form a hydrophilic PU foaming material, then color printing a print material onto the hydrophilic foaming film to form a pattern layer, trimming the paper material to form a paper plate having a desired range, and forming the paper plate as an utensil, and enabling the hydrophilic PU foaming film to form a three dimensional pattern area on a surface of the utensil by being heated and thus foaming with a heating temperature presenting when the utensil is formed, whereby a three dimensional pattern area may be directly formed onto a surface of a utensil.
    Type: Application
    Filed: April 2, 2015
    Publication date: October 6, 2016
    Inventor: Pei-Ti Lin
  • Publication number: 20160107786
    Abstract: A method for fabricating a heat isolative paper container, which provides a paper board having a plurality of seams at a circumference thereof, and then a heat isolative material containing the hollow body is coated locally on at least a surface of the paper board and exempted from the seams. The container is then folded up as a container, and the container is heated, so that a heat isolative layer is provided on the surface of the container and has a heat isolative coefficient ranging from 0.003 to 0.05. The heat isolative material is made of polyurethane, PU, acrylic resin, polyethylene (PE), polypropylene (PP), polylactide (PLA), and epoxy. In this manner, the heat isolative material containing the hollow body may achieve the efficacies of a reduced volume, a reduced transportation cost, and an improved heat isolative effect, by using an isolative layer containing a hollow body.
    Type: Application
    Filed: September 10, 2015
    Publication date: April 21, 2016
    Inventor: Pei-Ti Lin
  • Publication number: 20160017107
    Abstract: A foam container is made. A foam material is uniformly coated on at least one surface of the container. The foam material is formed by mixing a PU aqueous liquid, a defoamer, a thickener, a foaming agent, an adhesive and an additive. Fabrication speed is improved with reduced power consumption. The container thus fabricated has increased thickness, good hydrolysis resistance, good adhesion (without crumbs dropped), good heat insulation, good scratch resistance, good abrasion resistance, good printability and good workability for continuous production.
    Type: Application
    Filed: June 16, 2015
    Publication date: January 21, 2016
    Inventor: Pei-Ti Lin
  • Patent number: 8414727
    Abstract: A method for securing a bottom piece to a paper-made container forms first and second glue layers in one injection molding process. The method includes a mold set has a first concavity located corresponding to the open top of the paper-made container and communicating with a pouring path of an entrance via a first passage in the mold. A second concavity is defined in the mold and communicates with a second passage which communicates with the pouring path via a hole defined through the bottom piece. The two glue layers are formed within one molding process while the bottom piece is connected to the paper-made container.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: April 9, 2013
    Inventor: Pei-Ti Lin
  • Publication number: 20130000817
    Abstract: A method for securing a bottom piece to a paper-made container forms first and second glue layers in one injection molding process. The method includes a mold set has a first concavity located corresponding to the open top of the paper-made container and communicating with a pouring path of an entrance via a first passage in the mold. A second concavity is defined in the mold and communicates with a second passage which communicates with the pouring path via a hole defined through the bottom piece. The two glue layers are formed within one molding process while the bottom piece is connected to the paper-made container.
    Type: Application
    Filed: June 28, 2011
    Publication date: January 3, 2013
    Inventor: Pei-Ti Lin