Patents by Inventor Pei Yang

Pei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995478
    Abstract: A deployment request is received for a plurality of clusters within a plurality cloud computing environments. The deployment request relates to one or more operational actions for computing devices associated with the plurality of clusters. The plurality of clusters is associated with a single application programming interface (API). A set of standards are received for the plurality of clusters from the API. The plurality of clusters is configured according to the set of standards to create a configured plurality of clusters. The configured plurality of clusters are deployed within the plurality of cloud computing environments.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: May 28, 2024
    Assignee: Confluent, Inc.
    Inventors: Rajesh RC, Pei Yang, Andrew Ding, Rohit Bakhshi, Lokesh Shekar, Steven Costa
  • Patent number: 11993634
    Abstract: The present disclosure discloses a recombinant varicella-zoster virus (VZV) vaccine, including a fusion protein formed by an amino acid sequence of an extracellular domain of a recombinant glycoprotein gE of a live attenuated VZV strain (OKA strain) gene and an Fc fragment of human immunoglobulin. The present disclosure further provides preparation and use of the fusion protein, a corresponding recombinant gene, a eukaryotic expression vector, etc. The fusion protein of the present disclosure has prominent immunogenicity and can induce the high-level expression of neutralizing antibodies in serum.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: May 28, 2024
    Assignee: BEIJING LUZHU BIOTECHNOLOGY CO., LTD.
    Inventors: Jian Kong, Pei Hong Jiang, Ling Peng, Shuai Yang, Leitao Xu, Kun Zhang
  • Publication number: 20240161314
    Abstract: A method of estimating an optical flow includes processing, using an image processing pass, a first image and a second image separately, and estimating the optical flow based on a second image attention feature map of the first image and a second image attention feature map of the second image. The processing using the image processing pass includes extracting a feature map by encoding an image, outputting a first image fusion attention feature map by fusing row relationship information of the image with the image feature map, outputting a first image attention feature map of the image based on the first image fusion attention feature map and the image feature map, outputting a second image fusion attention feature map by fusing column relationship information of the image with the first image attention feature map, and generating a second image attention feature map of the image based on the second image fusion attention feature map and the first image attention feature map.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Zhaohui Lv, Pei You, Penghui Sun, Feng Zhu, Ran Yang, Huisi Wu, Wende Xie, Jingyin Lin, Zebin Zhao, Dong Kyung Nam, Jingu Heo
  • Patent number: 11985468
    Abstract: Disclosed are a method and a device for controlling a serial interface of a wireless earphone, a wireless earphone, and a computer readable storage medium. The method includes: disabling a serial interface function of the wireless earphone in a case that a first predetermined condition is met, where the first predetermined condition includes that the wireless earphone is outside a charging case, or the wireless earphone is in the charging case and a lid of the charging case is closed; and enabling the serial interface function of the wireless earphone in a case that a second predetermined condition is met, where the second predetermined condition includes that the wireless earphone is in the charging case and the lid of the charging case is open.
    Type: Grant
    Filed: September 28, 2019
    Date of Patent: May 14, 2024
    Assignee: GOERTEK INC.
    Inventor: Pei Yang
  • Patent number: 11980043
    Abstract: A metal mask and an inspecting method thereof are provided for improving quality standard detection. The metal mask has a first and a second long side and plural pattern regions. The method includes the followings steps Based on the pattern regions adjacent to the first and second long sides, a first and a second reference straight line adjacent to the first and second long sides respectively are defined. Then, a first maximum offset length between the pattern regions and the first reference straight line is measured. A second maximum offset length between the pattern regions and the second reference straight line is measured. When a difference between the first and second maximum offset lengths is less than or equal to 20 ?m, the metal mask is determined to meet an inspecting standard.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: May 7, 2024
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yun-Pei Yang, Mei-Lun Li, Wen-Yi Lin
  • Publication number: 20240145381
    Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
  • Publication number: 20240145645
    Abstract: The present disclosure provides an encapsulating structure, a display substrate and a manufacturing method therefor, and a display apparatus. The encapsulating structure is used for encapsulating components, and includes: a first encapsulating layer configured to cover the components; and a second encapsulating layer stacked with the first encapsulating layer; the second encapsulating layer is located on the side of the first encapsulating layer away from the components, a surface of the second encapsulating layer facing the first encapsulating layer is in contact with a surface of the first encapsulating layer facing the second encapsulating layer, and a surface of the second encapsulating layer away from the first encapsulating layer is substantially parallel to a plane where the encapsulating structure is located.
    Type: Application
    Filed: September 26, 2022
    Publication date: May 2, 2024
    Inventors: Jinpeng LI, Ming ZHAI, Zhifu YANG, Shubai ZHANG, Teng ZHANG, Jian LI, Heling ZHU, Pei QIN
  • Patent number: 11973027
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Yu Chou, Jr-Hung Li, Liang-Yin Chen, Su-Hao Liu, Tze-Liang Lee, Meng-Han Chou, Kuo-Ju Chen, Huicheng Chang, Tsai-Jung Ho, Tzu-Yang Ho
  • Patent number: 11971365
    Abstract: A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: April 30, 2024
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Shang-Chi Wang, Cheng-Jui Yang, Miao-Pei Chen, Han-Zong Wu
  • Patent number: 11968788
    Abstract: A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 23, 2024
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventors: Yong-Quan Yang, Han-Pei Huang
  • Publication number: 20240126625
    Abstract: A request to configure a connect cluster including one or more connectors for a cloud computing system is received. The request include a desired connector state. A connector specification file is automatically generated based on the desired connector state for the connect cluster via a declarative application programming interface (API). Application resources associated with the connect cluster are automatically configured based on the specification file.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 18, 2024
    Inventors: Rajesh RC, Pei Yang, Andrew Ding, Rohit Bakhshi, Lokesh Shekar, Steven Costa
  • Publication number: 20240118940
    Abstract: A deployment request is received for a plurality of clusters within a plurality cloud computing environments. The deployment request relates to one or more operational actions for computing devices associated with the plurality of clusters. The plurality of clusters is associated with a single application programming interface (API). A set of standards are received for the plurality of clusters from the API. The plurality of clusters is configured according to the set of standards to create a configured plurality of clusters. The configured plurality of clusters are deployed within the plurality of cloud computing environments.
    Type: Application
    Filed: December 14, 2022
    Publication date: April 11, 2024
    Inventors: Rajesh RC, Pei Yang, Andrew Ding, Rohit Bakhshi, Lokesh Shekar, Steven Costa
  • Publication number: 20240113575
    Abstract: A hybrid permanent magnet motor rotor rotates around a central axis, and includes: a rotor core provided with a plurality of magnet installation slots; and a plurality of magnet parts embedded inside a plurality of magnet installation slots respectively, wherein the rotor is provided with a plurality of first magnetic pole parts and a plurality of second magnetic pole parts, the magnetic poles of the first magnetic pole part and the second magnetic pole part are arranged in opposite and alternately in the circumferential direction, and the magnetic placement of the first magnetic pole part is different from that of the second magnetic pole part, the amount of magnets used in the second magnetic pole part is greater than that used in the first magnetic pole part.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 4, 2024
    Inventors: Kuan YANG, Pei-Chun SHIH, Ta-Yin LUO, Guo-Jhih YAN, Sheng-Chan YEN, Cheng-Tsung LIU
  • Publication number: 20240114758
    Abstract: A metal mask has a first surface, a second surface opposite to the first surface, first and second openings provided on the first and second surfaces respectively, and first and second through holes communicating with the first and second openings respectively. The juncture of the first and second through holes further has an annular protrusion. The mask satisfies the in equations: 1 ? ?m 2 < 1 2 × W × H < 15 ? ?m 2 ? and ? 30 ? ° < ? < 65 ? ° , wherein W is the horizontal distance between an edge of the first opening and an imaginary connecting line passing through an edge of the second opening and an end edge of the annular protrusion, H is the vertical distance between the end edge of the annular protrusion and the first surface, and ? is the included angle between the imaginary connecting line and an imaginary extending plane of the first surface. The metal mask is effective in reducing shadow effect, thereby improving evaporation quality.
    Type: Application
    Filed: November 15, 2022
    Publication date: April 4, 2024
    Inventors: Yun-Pei YANG, Chi-Wei LIN
  • Publication number: 20240091515
    Abstract: The present invention provides a transdermally deliverable microneedle patch, a manufacturing mold therefor, and a manufacturing method therefor. The transdermally deliverable microneedle patch includes: a basal layer for attaching to an epidermis, and a microneedle array and a bump array arranged on the basal layer. The microneedle array includes a plurality of microneedles that protrude and extend away from the basal layer. The microneedles are made of a predetermined medicament and a first dissolvable carrier component, and diameters of ends of the microneedles opposite to the basal layer are less than 50 ?m. The bump array includes a plurality of bumps that protrude and extend away from the basal layer. Diameters of ends of the bumps opposite to the basal layer are greater than 50 ?m. The bumps are arranged at intervals along a periphery of the microneedle array, and heights by which the bumps protrude from the basal layer are less than heights by which the microneedles protrude from the basal layer.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventor: YUN-PEI YANG
  • Publication number: 20240086701
    Abstract: A method is disclosed. The method includes receiving a training dataset including a set of training samples. The method then includes obtaining a first parameter value and a second parameter value. After the parameters are determined, the training dataset can be fed into a machine learning model to train the machine learning model using a neighborhood-specific loss function. The method can then include receiving a second dataset including a set of second samples. Each second sample can then be input into the trained machine learning model to determine a prediction score for each second sample, and the prediction scores can form a bimodal distribution centered around the first parameter and the second parameter.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Applicant: VISA INTERNATIONAL SERVICE ASSOCIATION
    Inventor: Pei Yang
  • Publication number: 20240075861
    Abstract: The present application discloses an adjustment assembly and a headrest. The adjustment assembly includes: a guiding rod; a fixing member, fixed to an end of the guiding rod; a driving portion, movably connected to the fixing member; and a first screw, engaged to the fixing member with threads, and the driving portion is connected to the fixing member by the first screw, wherein the driving portion includes a first motor, and the first motor is used to drive the driving portion to linearly move in respect to the fixing member along a direction close to or away from the fixing member. The adjustment assembly of the application can be adjusted electrically, such that the operation is convenient, and the structure is simple and reliable.
    Type: Application
    Filed: February 10, 2023
    Publication date: March 7, 2024
    Applicant: Southco Manufacturing and Technology (Shanghai) Co., Ltd.
    Inventors: Huaxian Xiao, Leo Lian, Pei Yang
  • Patent number: D1016001
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 27, 2024
    Assignee: CLOUDMINDS ROBOTICS CO., LTD.
    Inventor: Pei Yang
  • Patent number: D1019678
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: March 26, 2024
    Assignee: BEIJING KUAIMAJIABIAN TECHNOLOGY CO., LTD.
    Inventor: Pei Yang
  • Patent number: D1021300
    Type: Grant
    Filed: May 16, 2021
    Date of Patent: April 2, 2024
    Assignees: JIANGSU MIDEA CLEANING APPLIANCES CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Pei Cao, Tian Yang, Zhaohua Lyu, Runmin Hua