Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A semiconductor device and method of manufacture which utilize isolation structures between semiconductor regions is provided. In embodiments different isolation structures are formed between different fins in different regions with different spacings. Some of the isolation structures are formed using flowable processes. The use of such isolation structures helps to prevent damage while also allowing for a reduction in spacing between different fins of the devices.

Abstract: A semiconductor device and method of manufacture which utilize isolation structures between semiconductor regions is provided. In embodiments different isolation structures are formed between different fins in different regions with different spacings. Some of the isolation structures are formed using flowable processes. The use of such isolation structures helps to prevent damage while also allowing for a reduction in spacing between different fins of the devices.

Abstract: A semiconductor device and method of manufacture which utilize isolation structures between semiconductor regions is provided. In embodiments different isolation structures are formed between different fins in different regions with different spacings. Some of the isolation structures are formed using flowable processes. The use of such isolation structures helps to prevent damage while also allowing for a reduction in spacing between different fins of the devices.

Abstract: An adjustable Bluetooth wireless earphone primarily comprises an earphone body pin-connecting with a link-part at the front upper portion thereof so that the earphone can be rotated in all direction using the link-part as an axis and the link-part connects with a plug-set. The plug-set can co-move with the link-part. When the plug-set plugged the ear of the user, using the feature that the earphone body can be rotated in all direction, so the earphone body can be pressed close to the cheek portion of the user to form an angle between the earphone body and the plug-set, such that the plugged plug-set may stay more tightly on the ear of the user and not drop off easily.

Abstract: An adjustable Bluetooth wireless earphone primarily comprises an earphone body pin-connecting with a link-part at the front upper portion thereof so that the earphone can be rotated in all direction using the link-part as an axis and the link-part connects with a plug-set. The plug-set can co-move with the link-part. When the plug-set plugged the ear of the user, using the feature that the earphone body can be rotated in all direction, so the earphone body can be pressed close to the cheek portion of the user to form an angle between the earphone body and the plug-set, such that the plugged plug-set may stay more tightly on the ear of the user and not drop off easily.