Abstract: A dual-side display including an OLED substrate, a package substrate located at opposite side of the OLED substrate and frit seal sandwiched between the OLED substrate and the package substrate, wherein, the package substrate is an electrophoresis membrane, the part of the electrophoresis membrane that does not cover the OLED substrate is configured to display at one surface of the dual-side display, the OLED substrate is configured to display at another surface opposite to the one surface of the dual-side display. According to the dual-side display of the application, the dual-side display can effectively increase the light emitting area of the OLED, as well as the aperture ration and the display luminance of the OLED display panel, and achieves dual-side display to satisfy different requirements. Besides, the OLED display of the present application can make full use of light-emitting pixel area and obtain better light emitting effect.

Abstract: Provided is a method for making a reflective anode electrode for use in an organic electroluminescent display, comprising the steps of: sputtering a reflective Ag layer on a substrate in the presence of the inert gas in a first chamber; sputtering a transparent oxide conductive buffer layer on said Ag layer in the presence of the inert gas in a second chamber; and sputtering a transparent oxide conductive contact layer on said buffer layer in the presence of both inert gas and oxygen in the second chamber, to obtain the resulted reflective anode electrode. Also provided is a reflective anode electrode made by above method. The reflective anode electrode according to the present invention has higher reflectance and transmittance, due to the presence of the transparent conductive oxide buffer layer therein, which leads to the oxidation of the reflective layer minimized and the total transmittance substantially not affected.

Abstract: The present disclosure discloses a sputtering apparatus for reducing the damage to the base board caused by ITO sputtering and the method thereof. The sputtering chamber of the sputtering apparatus includes a base board connection structure for setting a base board and a target connection structure for setting a target. The target connection structure makes the target locate on the side of the base board connection structure. The target connection structure forms a precalculated angle with the base board. There is a space between the target and the base board. The target connection structure includes a negative potential generator for generating negative potential. The negative potential is applied to the target which is connected to the target connection structure. The sputtering chamber of the apparatus further includes an anode plate which is in parallel with the target material.