Abstract: A method of preparing a film comprises applying a composition on a substrate to give an uncured layer. The method further comprises irradiating the uncured layer to give the film. The composition comprises: (a) a polysiloxane resin, (b) a photoinitiator, and optionally (c) a functional diluent. The (a) polysiloxane resin includes acryloxy functionality and average concentration of OZ groups of at least 12 mole-percent relative to moles of silicon atoms in the (a) polysiloxane resin, where Z is independently H or an alkyl group.

Abstract: An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis acid to catalyze cure of the epoxy-groups. The composition can be coated on various substrates and cured to form a release liner.

Abstract: A silicate resin that is a liquid at 25° C. in the absence of any solvent is disclosed. The silicate resin has the average formula: [W]a[X]b[Y]c[Z]d, where subscript a is from greater than 0 to 0.5; subscript b is from greater than 0 to 0.5; subscript c is from 0 to 0.5; and subscript d is from greater than 0 to 0.6; with the proviso that a+b+c+d=1; and wherein W, X, Y and Z are defined siloxy units.

Abstract: A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically un saturated groups per molecule. The (A) silicate resin is miscible with the (B) organopolysiloxane in the absence of any solvent. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

Abstract: A pressure sensitive adhesive (PSA) composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically un saturated group per molecule. The PSA composition further comprises (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule. In addition, the PSA composition comprises (C) a hydrosilylation-reaction catalyst. The (A) silicate resin is miscible in the PSA composition in the absence of any solvent. The PSA composition can be at least partially cured to give a PSA.

Abstract: A base composition for forming a release coating composition is disclosed. The base composition comprises (A) a silicate resin that is a liquid at 25° C. in the absence of any solvent. The (A) silicate resin includes an average of at least one silicon-bonded ethylenically unsaturated group per molecule. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule. A method of preparing the base composition and a method of preparing a release coating composition are also disclosed.

Abstract: A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO1/2], [(OZ)qSiO(4-q)/2] and at least one of [(OZ)tREPSiO(3-t)/2] and [(OZ)dRREPSiO(2-d)/2]; where: each R is independently in each occurrence selected from hydrocarbyls, REP is an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.

Abstract: An ultraviolet (UV) curable organopolysiloxane composition with excellent workability when applied to a substrate is provided, in which a product obtained by curing the composition has a low dielectric constant. The UV curable organopolysiloxane composition comprises (A) one or more organosiloxane and/or organopolysiloxane having an average of two or more UV reactive functional groups in one molecule, and (B) one or more organosilane, organosiloxane, and/or organopolysiloxane having one UV reactive functional group in one molecule. An organic solvent is not included in the composition. In addition to components (A) and (B), the composition can comprise one or a plurality of additives selected from a group consisting of: (D1) nonionic surfactants not containing a silicon atom and are not acrylic; (D2) nonionic surfactants containing a silicon atom and having an HLB value of 4 or less; and (D3) silicone oils with a viscosity of 90 mPa-s or less at 25° C.

Abstract: A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula —CH2CH2CH2CO2C(R1a)3 or —CH(CH3)CH2CO2C(R1a)3, wherein each R1a is independently an unsubstituted (C1-C2)alkyl.

Abstract: A method for producing a patterned silicone layer; said method comprising steps of: (a) depositing on a substrate a composition comprising: (i) a polysiloxane comprising alkenyl groups, (ii) a silane crosslinker comprising silicon-hydrogen bonds, (iii) a hydrosilylation catalyst, and (iv) a photolatent amine generator, to form an uncured resin; (b) exposing the uncured resin to ultraviolet light or electron beam irradiation through a mask to produce a patterned resin; (c) heating the patterned resin; and (e) removing at least a part of the uncured portion of the patterned resin to produce a final patterned silicone layer.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and an oxaamine of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Abstract: A method for producing a patterned silicone layer; said method comprising steps of: (a) depositing on a substrate a composition comprising: (i) a polysiloxane comprising alkenyl groups, (ii) a silane crosslinker comprising silicon-hydrogen bonds, (iii) a hydrosilylation catalyst, and (iv) a photolatent amine generator, to form an uncured resin; (b) exposing the uncured resin to ultraviolet light or electron beam irradiation through a mask to produce a patterned resin; (c) heating the patterned resin; and (e) removing at least a part of the uncured portion of the patterned resin to produce a final patterned silicone layer.

Abstract: A bridged silicone resin is disclosed which has the general formula (1): (HSiO3/2)x(RSiO3/2)y(R1SiO3/2)z(SiO3/2—X—SiO3/2)s; wherein x and s are each from >0 to <1 and 0<y+z<1 such that x+y+z+s=1; R is independently an alkyl group; R1 is independently an aryl group; and X is divalent group comprising a silarylene group or a —(CH2)qSiR2R3[O(SiR2R3O)n]SiR2R3—(CH2)q?— group, where n is an integer from 1 to 10, each R2 and R3 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q? are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

Abstract: A bridged silicone resin is disclosed which has the general formula (1): (HSiO3/2)x(SiO3/2—X—SiO3/2)y(1); wherein x and y are each from >0 to <1 such that x+y=1; and wherein X is divalent group comprising a silarylene group or a —(CH2)qSiRR1[O(SiRR1O)n]SiRR1—(CH2)q— group, where n is an integer from 1 to 10, each R and R1 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q? are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

Abstract: A bridged silicone resin is disclosed which has the general formula (1): (HSiO3/2)x(SiO3/2—X—SiO3/2)y(1); wherein x and y are each from >0 to <1 such that x+y=1; and wherein X is divalent group comprising a silarylene group or a —(CH2)qSiRR1[O(SiRR1O)n]SiRR1—(CH2)q— group, where n is an integer from 1 to 10, each R and R1 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q? are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

Abstract: A bridged silicone resin is disclosed which has the general formula (1): (HSiO3/2)x(RSiO3/2)y(R1SiO3/2)z(SiO3/2—X—SiO3/2)s; wherein x and s are each from >0 to <1 and 0<y+z<1 such that x+y+z+s=1; R is independently an alkyl group; R1 is independently an aryl group; and X is divalent group comprising a silarylene group or a —(CH2)qSiR2R3[O(SiR2R3O)n]SiR2R3—(CH2)q?— group, where n is an integer from 1 to 10, each R2 and R3 is an independently selected substituted or unsubstituted hydrocarbyl group, and q and q? are each independently integers selected from 0 or from 1 to 6. Various methods relating to the bridged silicone resin and end uses thereof are also disclosed.

Abstract: An aged polymeric silsesquioxane comprising a product of heating a cured polymeric silsesquioxane of formula (I) (see specification) at a temperature of from 460° to 700° C., a formulation comprising the aged polymeric silsesquioxane and at least one additional constituent, methods of making and using the aged polymeric silsesquioxane, and manufactured articles and devices containing the aged polymeric silsesquioxane.

Abstract: A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula —CH2CH2CH2CO2C(R1a)3 or —CH(CH3)CH2CO2C(R1a)3, wherein each R1a is independently an unsubstituted (C1-C2)alkyl.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and a silyl-anhydride of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.

Abstract: A silsesquioxane-containing composition comprising a silsesquioxane resin and an oxaamine of formula (II) (see description), products prepared therefrom, photoresist compositions comprising the silsesquioxane-containing composition and a photoacid generator, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same.