Abstract: A silicon photonics optical transceiver device includes a silicon photonics optical module and a heat conducting housing that accommodates the silicon photonic optical module therein. The heat conducting housing has an inner surface formed with a first heat dissipation portion that wraps around and is in contact with transmitter optical sub-assemblies of the silicon photonics optical module to realize thermal conduction, and a second heat dissipation portion that is in contact with a digital signal processor of the silicon photonics optical module to realize thermal conduction.

Abstract: A method for live migration of a virtual machine in a MR-IOV environment is provided. The method is used in a system, wherein the system includes a plurality of computing hosts, an MR-IOV device, and a management host including a physical function and configured to implement a plurality of virtual functions. Eand each computing host and the management host are coupled to the MR-IOV device. The method includes: migrating, by a source computing host of the computing hosts, a source virtual machine in the source computing host to a destination VM in a destination computing host of the computing hosts, wherein the source VM includes a source VF; transmitting, by the destination computing host, a request message to a management host and reassigning, by the management host, a first VF corresponding to the source VF in the management host to the destination VM according to the request message.

Abstract: A method for live migration of a virtual machine in a MR-IOV environment is provided. The method is used in a system, wherein the system includes a plurality of computing hosts, an MR-IOV device, and a management host including a physical function and configured to implement a plurality of virtual functions. Eand each computing host and the management host are coupled to the MR-IOV device. The method includes: migrating, by a source computing host of the computing hosts, a source virtual machine in the source computing host to a destination VM in a destination computing host of the computing hosts, wherein the source VM includes a source VF; transmitting, by the destination computing host, a request message to a management host and reassigning, by the management host, a first VF corresponding to the source VF in the management host to the destination VM according to the request message.

Abstract: A ring network system using peripheral component interconnect express (PCIe) is disclosed. The ring network system includes N PCIe bridges. Each of the N PCIe bridges is connected to an individual server and includes a first port and a second port. The second port of an ith PCIe bridge of the N PCIe bridges is connected to the first port of an ((i mod N)+1)th PCIe bridge of the N PCIe bridges. Each of the N PCIe bridges includes an address mapping chip. The address mapping chip of each of the N PCIe bridges configurably maps to a system address of each of at least portion of N servers connected by the N PCIe bridges and configurably maps to an address of each of at least portion of the N PCIe bridges for setting up a mapping relationship between the N PCIe bridges.

Abstract: A ring network system using peripheral component interconnect express (PCIe) is disclosed. The ring network system includes N PCIe bridges. Each of the N PCIe bridges is connected to an individual server and includes a first port and a second port. The second port of an ith PCIe bridge of the N PCIe bridges is connected to the first port of an ((i mod N)+1)th PCIe bridge of the N PCIe bridges. Each of the N PCIe bridges includes an address mapping chip. The address mapping chip of each of the N PCIe bridges configurably maps to a system address of each of at least portion of N servers connected by the N PCIe bridges and configurably maps to an address of each of at least portion of the N PCIe bridges for setting up a mapping relationship between the N PCIe bridges.

Abstract: A display device includes a first light-emitting diode (LED) module, a second LED module, a first main-switch, a second main-switch and a plurality of branch-switches. The first LED module comprises a plurality of first LED units. The second LED module comprises a plurality of second LED units. The first main-switch is coupled to the first LED units. The second main-switch is coupled to the second LED units. The branch-switches are coupled to the first LED units and the second LED units.

Abstract: A ring network system using peripheral component interconnect express (PCIe) is disclosed. The ring network system includes N PCIe bridges. Each of the N PCIe bridges is connected to an individual server and includes a first port and a second port. The second port of an ith PCIe bridge of the N PCIe bridges is connected to the first port of an ((i+1) mod N)th PCIe bridge of the N PCIe bridges. Each of the N PCIe bridges includes an address mapping chip. The address mapping chip of each of the N PCIe bridges configurably maps to a system address of each of at least portion of N servers connected by the N PCIe bridges and configurably maps to an address of each of at least portion of the N PCIe bridges for setting up a mapping relationship between the N PCIe bridges.

Abstract: A disc package assembly for packaging and accommodating multiple discs is provided. The disc package assembly includes an upper cover and a base. The upper cover includes a through-hole, a first annular protrusion, a second annular protrusion, and a restraining portion. The thickness of the upper cover gradually increases from the edge of the upper cover toward the center. Further, the base includes a hollow fastening portion and a third annular protrusion. An annular part is formed at the upper end of the fastening portion and has several slots. The fastening portion includes a central through-hole penetrating through the base. The thickness of the base gradually increases from the edge of the base toward the center. The disc package assembly may further include a thermal shrink film for wrapping over the disc package assembly and the discs.

Abstract: A disc package assembly for packaging and accommodating multiple discs is provided. The disc package assembly includes an upper cover and a base. The upper cover includes a through-hole, a first annular protrusion, a second annular protrusion, and a restraining portion. The thickness of the upper cover gradually increases from the edge of the upper cover toward the center. Further, the base includes a hollow fastening portion and a third annular protrusion. An annular part is formed at the upper end of the fastening portion and has several slots. The fastening portion includes a central through-hole penetrating through the base. The thickness of the base gradually increases from the edge of the base toward the center. The disc package assembly may further include a thermal shrink film for wrapping over the disc package assembly and the discs.