Abstract: A confocal imaging system for imaging a surface. The system includes an area array sensor having rows of sensors for detecting light reflected from the surface, and an optical system arranged to focus light from different focal planes on the surface to different sensor rows of the area array sensor.

Abstract: An image acquisition system is provided that allows different lighting techniques to be applied to a scene containing an object of interest concurrently. Within a single position, multiple images which are illuminated by different lighting techniques can be acquired by selecting specific wavelength bands for acquiring each of the images. In a typical application, both back lighting and front lighting can be simultaneously used to illuminate an object, and different image analysis methods may be applied to the images.

Abstract: A high resolution imaging system for capturing a pair of object fields at extended resolution. The system has a twin input acquisition optical group, an image parting mechanism and a beam reception group where each module works to part and relay images of two object fields. The relayed images are segmented and directed to two image detector systems to extend the acquisition resolution. Electronic processing is used to merge and process the two image detector signals simultaneously. The resolution of the image detector is extended to produce high finesse qualities for high aspect ratio object fields.

Abstract: A line scan apparatus having a linear array of objective lenses which pair up with an associated linear array of optical sensors. The apparatus further comprises a bundle of tapering optical fibers which optically couple the pairs of objective lenses and optical sensors. Each fiber is arranged such that it optically couples at a wide end to one of the objective lens, and at a narrow end to one of the optical sensor. In operation, the linear array of objective lenses are scanned across the object, with the linear array of optical sensors capturing a one dimensional image line by line to build up a two dimensional image of the object.

Abstract: An apparatus for inspecting a printed circuit board assembly. The printed circuit board assembly includes a set of components mounted on a circuit board with solder joints. The inspection apparatus comprises imaging means for imaging along an optical axis so as to receive light reflected from surfaces of a component, coaxial light projecting means for projecting light onto surfaces of the component in a direction substantially parallel with the optical axis of the imaging means, and oblique light projecting means for projecting light onto surfaces of the component in an oblique direction relative to the optical axis of the imaging means.

Abstract: A method and an apparatus for the measurement and inspection of integrated circuit. Such an apparatus includes a camera for sensing an image of the integrated circuit (IC), an oblique light source, and a reflector. The camera has an optical axis passing through the IC normal to the plane of the IC. The oblique light source radiates light on the IC obliquely to the plane of the IC such that at least a portion of the oblique light source is positioned on one side of the optical axis. The reflector is positioned on the opposite side of the optical axis relative the portion of the oblique light source for reflecting light that crosses the optical axis from the oblique light source to the camera, such that at least a portion of the IC interposes between the portion of the oblique light source and the reflector. As a result, the shape of that portion of the IC is imaged on the camera by backlighting. The leads on the IC can be inspected in this manner.

Abstract: A system of optics, cameras and image processor arrangement capable of capturing images of lead tips of object fields resulting in accurate 3 dimensional positions of all the leads on a Integrated Circuit such as a Quad Flat Package (QFP). The system comprises of a telecentric lens attached to a camera working with an arrangement of mirrors and lighting. The telecentric lens and mirror optical layout splits the acquired image into 2 orthogonal viewing fields of the same lead tips of the QFP. The QFP is placed flat on a pedestal, and for any given side of the QFP, the first field views the lead tips from the front. The second field views the lead tips from the bottom of the IC package. Enhanced lead tip images are acquired by a lighting arrangement that casts illumination on the lead tips only. Electronic processing techniques are used to compute the geometry of the laeds such as global coplanarity, lead standoff and inspection of other lead defects.

Abstract: An optical inspection system for determining the positional information of a leaded electrical component with respect to a reference is provided. The system has a datum placed in proximity to leads of the leaded electrical component that provides the reference. It also has a light source that provides light that impinges on the leads and the datum so that the images of points on the leads and the datum are formed along various optical paths. The light source is set up so that a point on the leads and a point on the datum will lie in the same plane as their images along at least two optical paths that cross each other at an angle. In addition, the system has an imaging subsystem that captures the images along the two optical paths. The subsystem also correlates and analyses the captured images to provide positional information of the point on the leads with respect to the point on the datum.

Abstract: A method and an apparatus for the measurement and inspection of integrated circuit. Such an apparatus includes a camera for sensing an image of the integrated circuit (IC), an oblique light source, and a reflector. The camera has an optical axis passing through the IC normal to the plane of the IC. The oblique light source radiates light on the IC obliquely to the plane of the IC such that at least a portion of the oblique light source is positioned on one side of the optical axis. The reflector is positioned on the opposite side of the optical axis relative the portion of the oblique light source for reflecting light that crosses the optical axis from the oblique light source to the camera, such that at least a portion of the IC interposes between the portion of the oblique light source and the reflector. As a result, the shape of that portion of the IC is imaged on the camera by back-lighting. The leads on the IC can be inspected in this manner.

Abstract: An inspection system for detecting surface defects on an object is disclosed, which includes a light source operable to emit a broad spectrum visible light to illuminate the object and a video source operable to receive an image from light reflected from the object surface at a predetermined direction. The system further includes an image processor operable to compare the intensity of the reflected light received by the video source with a range of predetermined intensity values so as to detect defects on the object surface. The inspection system is particularly suited for use in semiconductor manufacturing.

Abstract: This invention relates to a technique of contrast measurement especially useful for the measurement of contrast of laser mark. The technique involves measuring the light intensity coming from a laser mark and the intensity coming from a background on the integrated circuit, calculating the contrast based on the intensities, and comparing to a gray scale. This invention enables contrast to be measured and communicated with respect to a set of references and hence eliminates subjective judgement.