Abstract: The embodiments of the present application provide a display panel and a display device. The display panel has a display area and a non-display area, the display panel includes: a substrate, a touch component arranged on the substrate, the touch component comprising touch electrodes located in the display area and touch leads connected to the touch electrodes and located in the non-display area; and a circuit board connected to the substrate in the non-display area, the touch leads being connected between the touch electrodes and the circuit board; and wherein the non-display area has a cutting track arranged surrounding at least part of the display area, at least part of the touch leads includes first redundant winding segments and connection segments, at least part of the first redundant winding segments extend along a direction away from the circuit board and fill between the cutting track and the display area.

Abstract: A display system includes an optical device configured according to constructive interference for a plurality of wavelengths at a focal length. The display system includes a fiber. The display system includes a controller configured to scan the fiber using a Lissajous scanning method to generate a display. The display can be disposed within a focal plane of the optical device. The controller is configured to modulate light intensity from the fiber. The controller can be configured to form a display image that passes through the optical device. The display system can include an optical combiner configured to reflect the display image from the optical device and form a virtual image. The optical device can be configured to magnify a display image from the display and form a virtual image.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A semiconductor device and a method of making the same are provided. A method according to the present disclosure includes forming a first type epitaxial layer over a second type source/drain feature of a second type transistor, forming a second type epitaxial layer over a first type source/drain feature of a first type transistor, selectively depositing a first metal over the first type epitaxial layer to form a first metal layer while the first metal is substantially not deposited over the second type epitaxial layer over the first type source/drain feature, and depositing a second metal over the first metal layer and the second type epitaxial layer to form a second metal layer.

Abstract: Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations comprising receiving, from a host system, a memory access command; responsive to determining that the memory access command is a program command, incrementing a consecutive counter value; determining whether the consecutive counter value satisfies a threshold criterion; responsive to determining that the consecutive counter value satisfies a threshold criterion, and setting an initial polling timer to a value associated the consecutive counter value satisfying the threshold criterion.

Abstract: Provided are an information determination method and device and a storage medium. The information determination method includes determining a time domain resource allocation (TDRA) table with a physical downlink control channel (PDCCH) related symbol served as a reference point of a start length indicator value (SLIV).

Abstract: Example implementations include receiving, by a wireless communication device from a network, first indication indicating a first First Type Frequency Resource (FTFR) and at least one Second Type Frequency Resource (STFR) mapped to the first FTFR. The wireless communication device communicates with the network using the first FTFR and the at least one STFR mapped to the first FTFR.

Abstract: A workpiece data processing method and apparatus are for accurately determining a relationship between production equipment processing parameters/ambient condition data and workpiece quality inspection results.

Abstract: A method including: storing results of a task in a pipeline executed in a container running in a computing environment; generating a check point for the task; and re-executing the pipeline from the check point for the task reusing the results.

Abstract: Methods and systems for techniques for multi-cell transmission are disclosed. In an implementation, a method of wireless communication includes receiving, by a wireless device, a configuration of multiple traffic channels on multiple cells scheduled by a downlink control information (DCI), and transmitting the multiple traffic channels on the multiple cells.

Abstract: Disclosed are a method and a device for balancing crankshaft deformation e, a crankshaft with counterweights determined according to the method, and a scroll compressor using the crankshaft. The method includes: determining a component centrifugal force required by a counterweight to overcome the crankshaft deformation caused by both an orbiting scroll centrifugal force and a gas force; and determining the counterweight according to the component centrifugal force. The counterweight is arranged on the crankshaft.

Abstract: Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100° C.; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass %, content of component (B) is 10 to 75 mass %, and content of component (C) is 1 to 20 mass %, each based on the total mass of components (A) to (D). The composition can be cured to form a cured product capable of storing and releasing thermal energy, and preventing the wax leaking/pumping out during heat cycling.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: The present application relates to the field of semiconductor manufacturing technologies, and in particular to a method and an apparatus for automatically processing wafers. The method for automatically processing the wafers includes the following steps: providing several wafers, wherein the wafers operate on a primary path, and the primary path is a path for forming semiconductor structures on the surfaces of the wafers; determining whether there is a need for detecting defects of the wafers, and if yes, automatically switching an operating path of the wafers to a secondary path; detecting the defects of the wafers in the secondary path; and determining whether the defect detection on the wafers is finished, and if yes, automatically switching the operating path of the wafers to the primary path. The application makes it possible to automatically detect the defects of the wafers with different SWR conditions, thereby improving the automation degree of machines.

Abstract: A method of manufacturing a light-emitting device, including: providing a substrate structure including a top surface; forming a precursor layer on the top surface; removing a portion of the precursor layer and a portion of the substrate from the top surface to form a base portion and a plurality of protrusions regularly arranged on the base portion; forming a buffer layer on the base portion and the plurality protrusions; and forming a III-V compound cap layer on the buffer layer; wherein one of the plurality of protrusions comprises a first portion and a second portion formed on the first portion; wherein the first portion is integrated with the base portion and has a first material which is the same as that of the base portion; and wherein the buffer layer contacts side surfaces of the plurality of protrusions and a surface of the base portion.

Abstract: A coupler for use in a wireless communication device includes a signal input end, a signal output end, a coupling end, an isolation end, a main signal hole, and a first coupling hole disposed on a PCB. A first end of the main signal hole is coupled to the signal input end. A second end of the main signal hole is coupled to the signal output end. A first end of the first coupling hole is coupled to the coupling end. A second end of the first coupling hole is coupled to the isolation end. In a thickness direction of the PCB, the first end of the first coupling hole and the first end of the main signal hole are close to a first side of the PCB, and the second end of the first coupling hole and the second end of the main signal hole are close to a second side of the PCB.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: A display panel is provided. In a display region configured to display an image, the display panel includes a base substrate; thin film transistors and display elements on the base substrate; an encapsulating layer encapsulating the display elements; and a touch electrode layer including mesh electrodes on a side of the encapsulating layer away from the base substrate. The encapsulating layer includes at least an organic encapsulating sub-layer having a first thickness in at least a sub-region of the transition region, and a second thickness in the display region, the first thickness being smaller than the second thickness. Mesh electrode lines of the mesh electrodes have a first line width in at least the sub-region of the transition region, and a second line width in the display region, the first line width being greater than the second line width.

Abstract: The present disclosure relates to a wide-range perpendicular sensitive magnetic sensor and the method for manufacturing the same, the magnetic sensor includes a substrate, a plurality of magnetic tunnel junctions, a plurality of magnetic flux regulators, a first output port and a second output port.

Abstract: Systems and methods for wireless communication systems are disclosed. In one aspect, the wireless communication method includes sending, by a network to a wireless communication device, first signaling for monitoring at least one downlink control channel, the at least one downlink control channel comprises a first downlink control channel and a second downlink control channel. The second downlink control channel comprises a retransmission of the first downlink control channel. The method includes sending, by the network to a plurality of wireless communication devices comprising the wireless communication device, the at least one downlink control channel.