Patents by Inventor Peng-Yih Peng

Peng-Yih Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6051139
    Abstract: A filtering device used to filter the slurry is disclosed, including a crossflow fan within the filter housing, and a driving mechanism relative to the crossflow fan under the filter housing to drive the crossflow fan spinning to agitate the slurry in the filter housing, so as to prevent the particles in the slurry from adhering to the surface of the filter. The filtering device further includes a spoiler between the crossflow fan and the filter, so that larger particles remain circulating somewhere between the tip of the spoiler and the crossflow fan, instead of flowing to the filter, to prolong the lifetime of the filter.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: April 18, 2000
    Assignee: United Microelectronics Corp.
    Inventors: Juen-Kuen Lin, Chien-Hsin Lai, Peng-Yih Peng
  • Patent number: 5993647
    Abstract: A slurry filtration system for supplying a slurry to a polisher to perform a chemical mechanical polishing process. The system comprises a first three-way valve, to receive the slurry supplied from an external system; a slurry pump, to control the slurry flowing from the first three-way valve, and to maintain a circulating state of the slurry within the circulating system after the chemical mechanical polishing process comes to a stop; a slurry filter, to filter a plurality of large size particles in the slurry pumped from the slurry pump; a second three-way valve, to supply the slurry flowing from the filter to the polisher; and a transportation pipe, connecting between the first and the second three-way valves to transport the slurry from the second three-way valve back to the first three-way valve when the polishing process has stopped.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: November 30, 1999
    Assignee: United Microelectronics Corp.
    Inventors: Chao-Yuan Huang, Peng-Yih Peng, Juan-Yuan Wu
  • Patent number: 5944593
    Abstract: A retainer ring is provided for used on the polishing head of a CMP machine, which can allow the slurry being applied to the CMP process to be uniformly distributed over the surface of the wafer. The retainer ring is designed for use on a CMP machine of the type having a polishing table, a polishing pad, a polishing head for holding a semiconductor wafer retained in fixed position, and means for applying a mass of slurry to the wafer. The polishing head is of the type including an air-pressure means which can apply air pressure to a wafer loader used to hold the wafer in position. The retainer ring is formed with a plurality of straight grooves spaced at substantially equal intervals, each being radially inclined in such a manner so as to form an acute angle of attack against the slurry on the outside of said retainer ring when said retainer ring spins. Further, the retainer ring can be additionally formed with at least one circular groove intercrossing all of said straight grooves.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: August 31, 1999
    Assignee: United Microelectronics Corp.
    Inventors: Daniel Chiu, C. C. Yang, Peng-Yih Peng, J. Y. Wu, J. S. Lai