Patents by Inventor Pengcheng Lv

Pengcheng Lv has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096729
    Abstract: A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventors: Dong Chen, Fenglong Lu, Yunyu Tang, Lei Shi, Yunfeng Liu, Shuyi Lv, Pengcheng Zhang
  • Publication number: 20190218226
    Abstract: Indenoisoquinoline topoisomerase I (Top1) inhibitors are a novel class of anticancer agents. The present invention discloses series of prodrugs of two indenoisoquinoline compounds currently in clinical trials as a potential treatment for cancers.
    Type: Application
    Filed: February 3, 2017
    Publication date: July 18, 2019
    Inventors: Mark S. Cushman, Pengcheng LV
  • Publication number: 20110024650
    Abstract: Terahertz emitting devices are disclosed. The terahertz emitting device comprises a wafer and a current source. The wafer includes silicon carbide and a dopant. In particular, the wafer may consist of 6H silicon carbide; a nitrogen dopant having a concentration of approximately 1018 cm?3; a boron dopant having a concentration of approximately 1016 cm?3; and an aluminum dopant having a concentration of approximately 1015 cm?3. The current source is electrically coupled to the wafer. The wafer emits radiation having a frequency between approximately 1 THz and 20 THz when driven by the current source.
    Type: Application
    Filed: June 9, 2010
    Publication date: February 3, 2011
    Applicant: UNIVERSITY OF DELAWARE
    Inventors: JAMES KOLODZEY, Matthew Coppinger, Guangchi Xuan, Pengcheng Lv
  • Patent number: 7386016
    Abstract: An electrically-pumped terahertz (THz) frequency radiation source (or detector), including an optical gain (or absorption) material with two electrodes electrically coupled to the optical gain material. The optical gain (or absorption) material is formed substantially of at least one group IV element and doped with at least one dopant, which has an intra-center transition frequency in a range of about 0.3 THz to 30 THz. Also, a method of manufacturing electrically-pumped THz frequency radiation sources (or detectors).
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: June 10, 2008
    Assignee: University of Delaware
    Inventors: James Kolodzey, Samit Kumar Ray, Thomas N. Adam, Pengcheng Lv, Ralph Thomas Troeger, Miron S. Kagan, Irina N. Yassievich, Maxim A. Odnoblyudov
  • Publication number: 20040228371
    Abstract: An electrically-pumped terahertz (THz) frequency radiation source (or detector), including an optical gain (or absorption) material with two electrodes electrically coupled to the optical gain material. The optical gain (or absorption) material is formed substantially of at least one group IV element and doped with at least one dopant, which has an intra-center transition frequency in a range of about 0.3 THz to 30 THz. Also, a method of manufacturing electrically-pumped THz frequency radiation sources (or detectors).
    Type: Application
    Filed: April 7, 2004
    Publication date: November 18, 2004
    Inventors: James Kolodzey, Samit Kumar Ray, Thomas N. Adam, Pengcheng Lv, Ralph Thomas Troeger, Miron S. Kagan, Irina N. Yassievich, Maxim A. Odnoblyudov