Abstract: A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.

Abstract: A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

Abstract: A semiconductor device includes a package body, a semiconductor die embedded in the package body and a heat spreader attached to a top surface of the package body and spaced from semiconductor die. The heat spreader may be formed of solder that is melted within a recess in the top surface of the package body.

Abstract: A semiconductor device has a die mounted on a die paddle that is elevated above and thermally connected via tie bars to a heat sink structure. Heat generated by the die flows from the die to the die paddle to the tie bars to the heat sink structure and then to either the external environment or to an external heat sink. By elevating the die/paddle sub-assembly above the heat sink structure, the packaged device is less susceptible to delamination between the die and die attach adhesive and/or the die attach adhesive and the die paddle. An optional heat sink ring can surround the die paddle.

Abstract: A semiconductor device including a lead frame, a routing substrate disposed within the lead frame, and an active component mounted on the routing substrate. The active component has a plurality of die pads. The routing substrate includes a set of first bond pads, a set of second bond pads, and interconnections, where each interconnection provides an electrical connection between a first bond pad and a corresponding second bond pad. The semiconductor device further includes electrical couplings between one or more of die pads of the active component and corresponding first bond pads of the routing substrate, as well as electrical couplings between leads of the lead frame and respective second bond pads of the routing substrate.

Abstract: A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.

Abstract: A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.

Abstract: A Quad Flat Pack (QFP) device includes a semiconductor die attached to a flag of a lead frame. Bonding pads of the die are electrically connected to inner and outer rows of leads of the lead frame with bond wires. The die, die flag, bond wires and portions of the inner and outer leads are covered with a mold compound, which defines a package body. The outer leads are similar to the gull-wing leads of a conventional QFP device while the inner leads form contact points at a bottom surface of the package body. A cut is performed on an inner side of the inner leads to separate the inner leads from the die pad.