Abstract: Described herein are chemiluminescent powders that can be applied to a variety of substrates or incorporated into a variety of articles that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Described herein are chemiluminescent powders that can be applied to a variety of substrates or incorporated into a variety of articles that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Described herein are chemiluminescent powders that can be applied to a variety of substrates that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Described herein are chemiluminescent powders that can be applied to a variety of substrates that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Described herein are chemiluminescent compositions that can be applied to a variety of substrates that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Described herein are chemiluminescent compositions that can be applied to a variety of substrates that are generally sensitive to existing chemiluminescent compositions. Methods for producing the chemiluminescent compositions are also provided.

Abstract: Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

Abstract: Polymeric subcomposites of a circuit board are interconnected by metallic dendrites on electrical contact pads whereby electrical contact pads of one or the subcomposites are larger widthwise than electrical contact pads of the other subcomposite.

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Abstract: A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.

Abstract: Disclosed is a method of forming a multilayer microelectronic circuit package. According to the disclosed method, the first layer of the package has features that are brought into proximity to an optical system which is adapted for imaging a surface of the layer. The optical system images features on the surface of the first layer, and generates targets around selected ones of the features. The, the next layer of the circuit package is brought into proximity to the optical system. This next layer is moved, i.e., translated and rotated, until selected features of the layer coincide with the targets generated through the optical system. This next layer is then placed atop the previous layer. Finally, the layers are laminated to form the multilayer microelectronic circuit package.

Abstract: A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.

Abstract: A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.

Abstract: A substrate such as carbon, graphite, or various semiconductors is coated with a "two-dimensional" thin film form of flat isolated crystallites of platinum, palladium or silver to form a catalyst useful in a fuel cell. The method of formation of the catalyst is to place the substrate in an electrolyte such as H.sub.2 PtCl.sub.6 about 1% and one molar sulfuric acid. The potentiostatic pulse plating method is employed. A high potential pulse of very short duration is followed by a low potential of substantial duration. The very high potential nucleates crystals at various randomly distributed nucleation sites such as imperfections in the surface of the substrate. The resulting catalyst has a large surface area of hexagonal crystals about 20 to 40 Angstroms in diameter.

Abstract: The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.

Abstract: Fuel cell catalysts which are efficient, long-lived, and refurbishable in-situ include gold carrying a UPD deposit of another element. UPD Ag, Pt, Pd, Ir, Rh or Tl, Pb and Bi on Au crystallites are carried on and bonded to another substrate. The crystallites cause dissociative adsorption of the oxygen molecules so that four electrons are produced per molecule during the reduction reaction which is involved. In an alkaline electrolyte, the catalyst metals such as Pd, Ir, Ag, Rh and Pt show no tendency to poison the counter electrode (counter relative to the other electrode) since each of those metals is a good catalyst for both electrodes. Suitable fuels include methanol (CH.sub.3 OH), formaldehyde (HCHO), and formic acid (HCOOH).

Abstract: An electrolytic system is provided with a gas fed cathode in contact with an electrolyte to which an additive of trifluoromethane sulfonic acid (TFMSA) is added. The system can be employed in fuel cells, industrial electrolytic cells for production of gases such as chlorine, and in metal-air batteries. Preferably the porous cathode incorporates a catalyst such as gold, platinum, palladium, silver, and spinels of Ni and Co. The supply of fluid to the anode of the fuel cell is a hydrocarbon or H.sub.2 dissolved in NaOH. Oxygen or air is supplied to the cathode of the fuel cell. In the industrial electrolytic cell, the anodic source of fluid and electrolyte is brine solution, and the cathodic electrolyte is dilute caustic. In the metal-air battery, an anodic solution of NaOH is supplied to an anode of Al, Ga, Zn, etc. The cathodic solution and configuration are the same as with the fuel cell.