Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: The invention is directed to a precision release aerosol dispenser for dispensing material from a pressurized source of material. The precision release aerosol dispenser comprises dispensing means for dispensing into the environment the material from the source of material, a microchip coupled to the dispensing means for controlling the release rate of the material to be dispensed, and means for initiating the dispensing means. The microchip usable in the precision aerosol dispenser of the invention is a multilayer device fabricated using MEMS fabrication techniques.

Abstract: The invention is directed to a precision release aerosol dispenser for dispensing material from a pressurized source of material. The precision release aerosol dispenser comprises dispensing means for dispensing into the environment the material from the source of material, a microchip coupled to the dispensing means for controlling the release rate of the material to be dispensed, and means for initiating the dispensing means. The microchip usable in the precision aerosol dispenser of the invention is a multilayer device fabricated using MEMS fabrication techniques.

Abstract: An apparatus including a tip-tilt mount, a mirror mounted in the tip-tilt mount, the tip-tilt mount determining an orientation of the mirror, and a forcing frame attached to the mirror and applying at least one bending moment to the mirror. Optionally, the forcing frame includes a vacuum cup connected to the mirror. Optionally, the forcing frame includes a bridge connected to the mirror. Optionally, the apparatus further includes an interferometer including the tip-tilt mirror mount, the mirror, and the forcing frame.