Abstract: A Quarter Size Small Outline Packages (QSOP) integrated resistor/capacitor network. The QSOP integrated resistor/capacitor network includes resistor/capacitor filters implemented in a QSOP package in integrated form. In one embodiment, the QSOP integrated resistor/capacitor network includes at least six ground pins for coupling capacitors of the resistor/capacitor filters with a common ground to maximize the attenuation of ultra-high frequency signals filtered through the resistor/capacitor filters.

Abstract: An integrated circuit for implementing a resistor network on a die of the integrated circuit. The integrated circuit includes a common conductor, which is disposed on a first side of the die and coupled to resistors of the resistor network. The integrated circuit further includes a substantially conductive substrate through the die. There is further included a conductive back side contact coupled to the substantially conductive substrate. The conductive back side contact is disposed on a second side of the die opposite the first side, whereby the common conductor, the substantially conductive substrate, and the conductive back side contact form a common conducting bus from the common conductor to the conductive back side contact through the die.