Abstract: A method for producing a plate heat exchanger uses micro deformation technology to form fins on both sides of a sheet of metal. In the method, a substantially flat, substantially thin sheet of metal is restrained in a tooling fixture. The sheet has a first flat side and a second flat side. Fins are formed in the first and second flat sides of the sheet by slicing the sheet with a tool to create monolithic fins extending from the sheet. A base plate is formed by cutting the finned portions from the sheet. The base plate is used to form a plate heat exchanger.

Abstract: A cold plate is manufactured by obtaining a base plate with a top surface, a bottom surface, and an edge. An inlet trough and an outlet trough are machined in the top surface. Fins are cut into the base plate with a tool that contacts the base plate in either the inlet trough and the outlet trough and then exits the base plate in the other of the inlet trough and the outlet trough. An inlet nozzle indent is machined from the inlet trough to the edge of the base plate, and an outlet nozzle indent is machined from the outlet trough to the edge of the base plate. A cover covers the inlet and outlet nozzle indents, and an inlet nozzle and outlet nozzle are secured to the inlet and outlet nozzle indents.

Abstract: A cold plate has a base plate connected to a cover to form an enclosure, with an inlet and outlet nozzle penetrating the enclosure for coolant flow. The base plate includes a top surface opposite a bottom surface, Where the top surface includes enhancements positioned within the enclosure under the cover. The base plate has an inlet trough and an outlet trough that serve as headers, so the inlet nozzle connects to the inlet trough, and coolant from the inlet trough can flow through the enhanced surface, collect in the outlet trough, and then exit the cold plate through the outlet nozzle. The enhanced surface includes enhancements that begin at a point in between the bottom surface and the top surface, and the enhancements extend to a point above the top surface. In another embodiment, electronic components can be soldered on a cold plate. The electronic component can be positioned in contact with the cold plate, and solid solder can be positioned at a contact point on the electronic component.

Abstract: A system and method for identification and location of an asset by tracking the mover of the asset using a locating device associated with the mover and identifying the asset using an identification reader associated with the mover and a passive identification tag associated with the asset. A single mover may move many assets. An asset is identified; the mover then moves the asset to a destination location, whereupon the mover and asset position are determined. The asset location may then be recorded in memory. The measurement of the destination location may be extended from the location measured by the active location device by using additional measurement devices, for example a forklift height sensor. A further embodiment utilizes RFID or barcode technology for the passive tag and may utilize near field positioning technology for the active location device.