Patents by Inventor Peter Beverley Powell Phipps
Peter Beverley Powell Phipps has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7201637Abstract: A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.Type: GrantFiled: December 20, 2005Date of Patent: April 10, 2007Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Florence Eschbach, Eric James Lee, Peter Beverley Powell Phipps, Amanda Baer, Edward Hin Pong Lee, Francisco Martin
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Patent number: 7087183Abstract: A method for removing a thin metallic layer using an etchant solution is provided for essentially eliminating undercutting in a thin metallic layer such as a seed layer in a magnetic recording head. The etchant solution has a suitable solvent additive such as glycerol or methyl cellulose. With suitable solvent additives, which generally increase solvent viscosity, lateral etching rates are similar to surface etch rates and undercutting is essentially eliminated.Type: GrantFiled: June 24, 2005Date of Patent: August 8, 2006Assignee: International Business Machines CorporationInventor: Peter Beverley Powell Phipps
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Patent number: 7035047Abstract: A magnetic head having read and write elements is provided according to one embodiment. The head includes a substrate. An undercoating is coupled to the substrate. The undercoating has a preferred thickness of between about 1.5 and 0.5 microns or less in a direction perpendicular to the planar surface of the substrate engaging the undercoating. Preferably, the undercoating is reduced to a desired thickness during fabrication using chemical mechanical polishing. The undercoating is constructed of a material having a thermal conductivity greater than that of amorphous Al2O3. An electric contact pad is operatively coupled to a layer positioned between the pad and the undercoating. Electric contact pads of read and write elements are preferably separated from the undercoating by insulation planarization layers. A write element is coupled to the undercoating. The write element has an electrically conductive coil.Type: GrantFiled: October 15, 2002Date of Patent: April 25, 2006Assignee: International Business Machines CorporationInventors: Wen-Chien Hsiao, Peter Beverley Powell Phipps, Yong Shen, John Jaekoyun Yang, Samuel Wei-san Yuan
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Patent number: 7025659Abstract: A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.Type: GrantFiled: January 14, 2002Date of Patent: April 11, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Florence Eschbach, Eric James Lee, Peter Beverley Powell Phipps, Amanda Baer, Edward Hin Pong Lee, Francisco Martin
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Publication number: 20040112868Abstract: An etchant solution is provided for essentially eliminating undercutting in a thin metallic layer such as a seed layer in a magnetic recording head. The etchant solution has a suitable solvent additive such as glycerol or methyl cellulose. With a suitable solvent additives, which generally increase solvent viscosity, lateral etching rates are similar to surface etch rates and undercutting is essentially eliminated.Type: ApplicationFiled: December 13, 2002Publication date: June 17, 2004Inventor: Peter Beverley Powell Phipps
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Publication number: 20040070870Abstract: A magnetic head having read and write elements is provided according to one embodiment. The head includes a substrate. An undercoating is coupled to the substrate. The undercoating has a preferred thickness of between about 1.5 and 0.5 microns or less in a direction perpendicular to the planar surface of the substrate engaging the undercoating. Preferably, the undercoating is reduced to a desired thickness during fabrication using chemical mechanical polishing. The undercoating is constructed of a material having a thermal conductivity greater than that of amorphous Al2O3. An electric contact pad is operatively coupled to a layer positioned between the pad and the undercoating. Electric contact pads of read and write elements are preferably separated from the undercoating by insulation planarization layers. A write element is coupled to the undercoating. The write element has an electrically conductive coil.Type: ApplicationFiled: October 15, 2002Publication date: April 15, 2004Applicant: INTERNATIONAL BUSINESS MACHINESInventors: Wen-Chien Hsiao, Peter Beverley Powell Phipps, Yong Shen, John Jaekoyun Yang, Samuel Wei-San Yuan
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Publication number: 20030135986Abstract: A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method begins with preparation of a chemical mechanical polishing (CMP) slurry targeted at equaling the removal rate of the materials to be planarized. The CMP slurry includes a liquid vehicle, an abrasive, and a surfactant. The CMP slurry is applied to the surface of the structures to be planarized and the structures are simultaneously planarized using a CMP planarization technique.Type: ApplicationFiled: January 14, 2002Publication date: July 24, 2003Applicant: International Business Machines CorporationInventors: Florence Eschbach, Eric James Lee, Peter Beverley Powell Phipps, Amanda Baer, Edward Hin Pong Lee, Francisco Martin
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Patent number: 6554878Abstract: In a first aspect a slurry is provided for chemically mechanically polishing alumina and nickel iron to a common plane and in a second aspect a slurry is provided for additionally chemically mechanically polishing copper to a common plane. The slurry includes a first concentration of colloidal silica, a second concentration of potassium and/or sodium persulfate and a third concentration of ammonium persulfate. In the first aspect the first and second concentrations are tailored to chemically mechanically polish the alumina and the nickel iron at the same rate to a common plane and in the second aspect the slurry includes a third concentration of ammonium persulfate at a proper ratio to the potassium or sodium persulfate to chemically mechanically polish the copper at the same rate as the other materials to the same plane.Type: GrantFiled: June 14, 1999Date of Patent: April 29, 2003Assignee: International Business Machines CorporationInventors: Frederick Hayes Dill, Jr., Eric James Lee, Peter Beverley Powell Phipps
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Patent number: 6428715Abstract: A method for producing sliders without alumina overcoat protrusion on the air bearing surface. The method comprises a method for removing alumina protrusion on the air bearing surface of a slider comprising contacting the air bearing surface of the slider with an aqueous base having a pH of about 9 to about 11.Type: GrantFiled: October 19, 2000Date of Patent: August 6, 2002Assignee: International Business Machines CorporationInventors: Daniel Gerard Abels, Yu-En Percy Chang, Peter Beverley Powell Phipps, Jila Tabib, Benjamin Lu-Chen Wang
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Patent number: 6221559Abstract: The front edge of the a zero throat height (ZTH) defining insulation layer in a magnetic head is formed with a central portion which is centered with respect to a second pole tip with first and second lateral portions which are on each side of the central portion and parallel to the ABS. The central portion is recessed from the ABS a distance appropriate for defining the ZTH between the first and second pole pieces of the head and the first and second lateral edges are further recessed into the head so as to increase the volume of the overcoat layer between the ABS and the first and second lateral edges. The increased volume of the overcoat layer better absorbs stresses and strains due to shock loading and temperature so as to reduce cracking of the head at the ABS.Type: GrantFiled: December 29, 1998Date of Patent: April 24, 2001Assignee: International Business Machines CorporationInventors: Edward Hinpong Lee, Peter Beverley Powell Phipps
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Patent number: 5880915Abstract: The reconfiguration of a magnetic write head minimizes cracking at the ABS. This is accomplished by selectively reconfiguring the front edge of the insulation layer that defines the zero throat height (ZTH) so as to increase the volume of the overcoat layer which interfaces with the reconfigured edge. The front edge of the ZTH-defining insulation layer has a central portion which is centered with respect to the second pole tip and first and second lateral portions which are on each side of the front portion and parallel to the ABS. The front edge portion is recessed from the ABS a distance appropriate for defining the ZTH between the first and second pole pieces of the write head. The first and second lateral edges are further recessed into the head so as to increase the volume of the overcoat layer between the ABS and the first and second lateral edges.Type: GrantFiled: October 21, 1996Date of Patent: March 9, 1999Assignee: International Business Machines CorporationInventors: Edward Hinpong Lee, Peter Beverley Powell Phipps
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Patent number: 5730851Abstract: A metallic sheet for an electronic housing having a zinc coating on a steel base and a thin metal film, preferably a copper film, covering the zinc coating on one or both sides of the sheet, and a method of making the metal film. The metal film reduces whiskering of the zinc in the zinc coating. Whiskering can also be prevented on other metals anodic to copper such as, for example, tin and cadmium.Type: GrantFiled: February 6, 1996Date of Patent: March 24, 1998Assignee: International Business Machines CorporationInventors: Peter Arrowsmith, Peter Beverley Powell Phipps