Abstract: A disc brake for utility vehicles includes a brake disc, a first brake lining on a first side of the brake disc and a second brake lining on a second side of the brake disc opposite the first side. A spreading device is also provided which generates a force that moves the first and the second brake lining away from one another.

Abstract: A method of bonding semiconductor components is described. In one aspect a first component, for example a semiconductor die, is bonded to a second component, for example a semiconductor wafer or another die, by direct metal-metal bonds between metal bumps on one component and corresponding bumps or contact pads on the other component. In addition, a number of solder bumps are provided on one of the components, and corresponding contact areas on the other component, and fast solidified solder connections are established between the solder bumps and the corresponding contact areas, without realizing the metal-metal bonds. The latter metal-metal bonds are established in a heating step performed after the soldering step. This enables a fast bonding process applied to multiple dies bonded on different areas of the wafer and/or stacked one on top of the other, followed by a single heating step for realizing metal-metal bonds between the respective dies and the wafer or between multiple stacked dies.

Abstract: A method of bonding semiconductor components is described. In one aspect a first component, for example a semiconductor die, is bonded to a second component, for example a semiconductor wafer or another die, by direct metal-metal bonds between metal bumps on one component and corresponding bumps or contact pads on the other component. In addition, a number of solder bumps are provided on one of the components, and corresponding contact areas on the other component, and fast solidified solder connections are established between the solder bumps and the corresponding contact areas, without realizing the metal-metal bonds. The latter metal-metal bonds are established in a heating step performed after the soldering step. This enables a fast bonding process applied to multiple dies bonded on different areas of the wafer and/or stacked one on top of the other, followed by a single heating step for realizing metal-metal bonds between the respective dies and the wafer or between multiple stacked dies.

Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient.

Abstract: The disclosed technology generally relates to semiconductor wafer bonding, and more particularly to direct bonding by contacting surfaces of the semiconductor wafers. In one aspect, a method for bonding a first semiconductor substrate to a second semiconductor substrate by direct bonding is described. The substrates are both provided on their contact surfaces with a dielectric layer, followed by a CMP step for reducing the roughness of the dielectric layer. Then a layer of SiCN is deposited onto the dielectric layer, followed by a CMP step which reduces the roughness of the SiCN layer to the order of 1 tenth of a nanometer. Then the substrates are subjected to a pre-bond annealing step and then bonded by direct bonding, possibly preceded by one or more pre-treatments of the contact surfaces, and followed by a post-bond annealing step, at a temperature of less than or equal to 250° C.

Abstract: The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient.

Abstract: The disclosed technology generally relates to semiconductor wafer bonding, and more particularly to direct bonding by contacting surfaces of the semiconductor wafers. In one aspect, a method for bonding a first semiconductor substrate to a second semiconductor substrate by direct bonding is described. The substrates are both provided on their contact surfaces with a dielectric layer, followed by a CMP step for reducing the roughness of the dielectric layer. Then a layer of SiCN is deposited onto the dielectric layer, followed by a CMP step which reduces the roughness of the SiCN layer to the order of 1 tenth of a nanometer. Then the substrates are subjected to a pre-bond annealing step and then bonded by direct bonding, possibly preceded by one or more pre-treatments of the contact surfaces, and followed by a post-bond annealing step, at a temperature of less than or equal to 250° C.

Abstract: A dressing tool (100, 200, 300, 400, 500) for conditioning of grinding bodies, especially ceramically bonded grinding bodies, the dressing tool (100, 200, 300, 400, 500) comprising a base body which bears a self-supporting function coating (120, 220, 320, 420, 520) which defines the working region of the dressing tool, the function coating (120, 220, 320, 420, 520) comprising a porous bonding matrix (121, 221, 321, 421, 521) which is uniformly penetrated with grains of hard material (122, 222, 322, 422, 522), is characterized in that in the porous bonding matrix (121, 221, 321, 421, 521) there are additionally embedded reinforcing elements (130, 230, 330, 430, 530) of a hard material for stabilizing the function coating (120, 220, 320, 420, 520).

Abstract: The present invention provides means and methods of transforming plant cells, seeds, tissues or whole plants in order to yield transformants capable of expressing all enzymes of the carotenoid biosynthesis pathway that are essential for the targeted host plant to accumulate carotenes and/or xanthophylls of interest. The present invention also provides DNA molecules designed to be suitable for carrying out the method of the invention, and plasmids or vector systems comprising said molecules. Furthermore, the present invention provides transgenic plant cells, seeds, tissues and whole plants that display an improved nutritional quality and contain such DNA molecules and/or that have been generated by use of the methods of the present invention.

Abstract: A space-dividing wall panel has glass panels mounted on opposite faces of the wall panel to permit viewing therethrough. Each glass panel is defined by a sheet of glass and edge rails extending about the periphery of the glass. The edge rails include fixing channels on opposite sides thereof which are press-fit onto respective edges of the glass without the use of a resilient gasket within the fixing channel.

Abstract: The present invention provides means and methods of transforming plant cells, seeds, tissues or whole plants in order to yield transformants capable of expressing all enzymes of the carotenoid biosynthesis pathway that are essential for the targeted host plant to accumulate carotenes and/or xanthophylls of interest. The present invention also provides DNA molecules designed to be suitable for carrying out the method of the invention, and plasmids or vector systems comprising said molecules. Furthermore, the present invention provides transgenic plant cells, seeds, tissues and whole plants that display an improved nutritional quality and contain such DNA molecules and/or that have been generated by use of the methods of the present invention.

Abstract: The present invention provides a thermodynamically stable modification of (±)1-(4-carbazolyloxy)-3-[2-(2-methoxyphenoxy)ethylamino]-2-propanole and pharmacologically acceptable salts or optically active forms thereof as well as processes for their preparation and pharmaceutical compositions containing one or more of them.

Abstract: The invention relates to a deflecting arrangement having a first deflecting element (34) for deflecting conveyable-article carriers (7), and having a second deflecting element (50) for deflecting an endless drive belt (9) for driving the conveyable-article carriers (7) in an overhead conveying arrangement, the deflecting arrangement (3′) forming one of two deflecting stations around which the endless drive belt (9), which is driven for movement, runs as a loop, and the endless drive belt (9) being guided along the route region from deflecting station to deflecting station for carrying along conveyable-article carriers along the conveying route of the overhead conveying arrangement. For the purpose of adjusting the tensioning of the drive belt (9), the second deflecting element (50) is arranged on a mount (30) such that it can be displaced relative to the first deflecting element (34).

Abstract: The present invention provides a thermodynamically stable modification of (±)1-(4-carbazolyloxy)-3-[2-(2-methoxyphenoxy)ethylamino]-2-propanole and pharmacologically acceptable salts or optically active forms thereof as well as processes for their preparation and pharmaceutical compositions containing one or more of them.

Abstract: A space-dividing wall panel has glass panels mounted on opposite faces of the wall panel to permit viewing therethrough. Each glass panel is defined by a sheet of glass and edge rails extending about the periphery of the glass. The edge rails include fixing channels on opposite sides thereof which are press-fit onto respective edges of the glass without the use of a resilient gasket within the fixing channel.

Abstract: The invention proposes a conveying apparatus with a three-dimensionally movable receiving conveyor for receiving conveyable-article carriers (3) from a suspended conveyor in which the conveyable-article carriers (3) are guided on a running-roller guide profile for movement along a first conveying section (5) and are supported in a suspended manner on own running rollers (29).

Abstract: A machine alignment compensation actuator system is disclosed. The system is designed to selectively orient the tool head of a machine tool to maintain the tool along a desirable axis of alignment. The system includes a framework and a machine slide assembly configured to hold the tool. An actuator assembly having a plurality of actuators is disposed between the machine slide assembly and the framework. Each actuator is disposed at a unique location to permit selective reorientation of the machine slide assembly and tool with respect to the framework.

Abstract: A process for the preparation of 2-[4-(4-chlorobenzoylaminoethyl)-phenoxy]-2-methylpropionic acid of the formula ##STR1## which process comprises reacting N-(4-chlorobenzoyl)-tyramine with acetone and chloroform in a mole ratio of 1:20-100:2-10, in the presence of 3 to 4 moles of alkali per mole of chloroform, at a temperature of from about 10.degree. to 40.degree. C.