Abstract: Methods are directed to checking a pressure sensor comprising a reversibly deformable, in particular reversibly bendable measuring element which supplies a measurement signal having a value depending on the degree of deformation of said measuring element, to the effect of whether the pressure sensor withstands a required maximum pressure which is larger by a predeterminable factor than a nominal pressure for which the sensor is designed. The methods generally involve use of a reference pressure sensor, which is structurally identical to the pressure sensor to be checked, for generating a distance/pressure characteristic curve and for evaluating the critical pressure required for breaking the measuring element. The critical pressure can then be used to determine if a particular value of pressure is larger than the required maximum pressure that the pressure sensor to be checked is intended to withstand.

Abstract: In the method for measuring a micromechanical semiconductor component which comprises a reversibly deformable measuring element sensitive to mechanical stresses, which is provided with electronic circuit elements and terminal pads for tapping measurement signals, the measuring element (18) of the semiconductor component (16), for the purpose of determining the distance/force and/or distance/pressure characteristic curve thereof, is increasingly deformed by mechanical action of a plunger (32) which can in particular be advanced step by step. After a or after each step-by-step advancing movement of the plunger (32) by a predetermined distance quantity, the current measurement signals are tapped via the terminal pads (24). The semiconductor component (16) is qualified on the basis of the obtained measurement signals representing the distance/force and/or distance/pressure characteristic curve.

Abstract: The invention relates to a method for checking a pressure sensor comprising a reversibly deformable, in particular reversibly bendable measuring element (18) which supplies a measurement signal having a value depending on the degree of deformation of said measuring element, to the effect of whether the pressure sensor withstands a required maximum pressure which is larger by a predeterminable factor than a nominal pressure for which the sensor is designed.

Abstract: In the method for measuring a micromechanical semiconductor component which comprises a reversibly deformable measuring element sensitive to mechanical stresses, which is provided with electronic circuit elements and terminal pads for tapping measurement signals, the measuring element (18) of the semiconductor component (16), for the purpose of determining the distance/force and/or distance/pressure characteristic curve thereof, is increasingly deformed by mechanical action of a plunger (32) which can in particular be advanced step by step. After a or after each step-by-step advancing movement of the plunger (32) by a predetermined distance quantity, the current measurement signals are tapped via the terminal pads (24). The semiconductor component (16) is qualified on the basis of the obtained measurement signals representing the distance/force and/or distance/pressure characteristic curve.

Abstract: The device for removing bond pad material deposits adhering to the ends of contacting needles for contacting the bond pads of a die is provided with a substrate having an adhesive upper side adapted to be contacted by the ends of the contacting needles and being configured such that the adhesive force between the deposits and the upper side of the substrate is larger than the adhesive force between the deposits and the ends of the contacting needles.