Abstract: A method of treating particulate titanium dioxide includes providing the particulate titanium dioxide which includes a crystal structure and then treating the particulate titanium dioxide with a coating agent that is an alkylphosphonic acid or an ester thereof, and steam micronizing the particulate titanium dioxide with a steam micronizer so that a vapor exit temperature from the steam micronizer is 150° C. or higher, so as to obtain a micronized particulate titanium dioxide which includes the coating agent at an outer surface. The particulate titanium dioxide includes an aluminum oxide coating and/or includes within the crystal structure aluminum oxide in a molar excess of an amount required to compensate any Nb2O5 in the crystal structure. The alkylphosphonic acid includes a C6-C22 alkyl group.

Abstract: A flow sensor is provided to enable volumetric dose data to be acquired automatically by sampling flow rates of insulin measured by a flow sensor exposed to a flow manifold though which the insulin flows. The flow sensor preferably connects to a standard insulin pen on one end, and to a standard pen needle on the other end. Particular geometries and algorithms are utilized to accommodate the unique requirements of insulin flow determination during an injection event.

Abstract: A flow sensor is provided to enable volumetric dose data to be acquired automatically by sampling flow rates of insulin measured by a flow sensor exposed to a flow manifold though which the insulin flows. The flow sensor preferably connects to a standard insulin pen on one end, and to a standard pen needle on the other end. Particular geometries and algorithms are utilized to accommodate the unique requirements of insulin flow determination during an injection event.

Abstract: A method of treating particulate titanium dioxide includes providing the particulate titanium dioxide which includes a crystal structure and then treating the particulate titanium dioxide with a coating agent that is an alkylphosphonic acid or an ester thereof, and steam micronizing the particulate titanium dioxide with a steam micronizer so that a vapor exit temperature from the steam micronizer is 150° C. or higher, so as to obtain a micronized particulate titanium dioxide which includes the coating agent at an outer surface. The particulate titanium dioxide includes an aluminum oxide coating and/or includes within the crystal structure aluminum oxide in a molar excess of an amount required to compensate any Nb2O5 in the crystal structure. The alkylphosphonic acid includes a C6-C22 alkyl group.

Abstract: A flow sensor is provided to enable volumetric dose data to be acquired automatically by sampling flow rates of insulin measured by a flow sensor exposed to a flow manifold though which the insulin flows. The flow sensor preferably connects to a standard insulin pen on one end, and to a standard pen needle on the other end. Particular geometries and algorithms are utilized to accommodate the unique requirements of insulin flow determination during an injection event.

Abstract: A flow sensor is provided to enable volumetric dose data to be acquired automatically by sampling flow rates of insulin measured by a flow sensor exposed to a flow manifold though which the insulin flows. The flow sensor preferably connects to a standard insulin pen on one end, and to a standard pen needle on the other end. Particular geometries and algorithms are utilized to accommodate the unique requirements of insulin flow determination during an injection event.

Abstract: A method for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The method and apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time.

Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Abstract: Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.

Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical contacts is described. The apparatus comprises a JEDEC standard tray receiving apparatus comprising a plurality of tray aligners to align the tray into a predetermined position to account for dimensional tolerances of the tray. The apparatus further comprises a test assembly proximate the tray receiving apparatus. The assembly comprises; a plurality of test circuits corresponding in number to the number of cells in the tray, a plurality of groups of test contacts, each of group of the test contacts being coupled to one of the test circuits and being oriented to engage a plurality of electrical contacts of a SIP device disposed in a corresponding one of the cell, the plurality of test circuits being operable to simultaneously, electrically test a predetermined number of SIP devices in a JEDEC standard tray engaged by the receiving apparatus without removing the SIP devices from the tray.

Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus of the illustrative embodiment comprises a test hive comprising: a plurality of test circuits corresponding in number to the number of cells in the tray; and a plurality of groups of test contacts, each of the groups of the test contacts being coupled to one of the test circuits and being oriented to engage the plurality of electrical contacts of SIP device disposed in a corresponding one of the cells, the test hive being operable to simultaneously, electrically test all of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Abstract: A method and apparatus for testing micro SD devices each having a plurality of electrical leads is described. The method and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Abstract: A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Abstract: A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time.

Abstract: Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The and apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray: and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The lest hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus of the illustrative embodiment comprises a test hive comprising: a plurality of test circuits corresponding in number to the number of cells in the tray; and a plurality of groups of test contacts, each of the groups of the test contacts being coupled to one of the test circuits and being oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells, the test hive being operable to simultaneously, electrically test all of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray.

Abstract: A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

Abstract: Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray: and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.