Abstract: Systems and method are described for a terminal block that can include an insulating block that is composed of an electrically insulating material. The insulating structure can have a first via extending between a first and second opening in the insulating block. A second via can extend between a third and fourth opening in the insulating block. A distance between the first and second openings may be less than a distance between the third and fourth openings. A first electrical conducting element can extend between the first and second openings. A second electrical conducting element can extend between the third and fourth openings. The first and second electrical conducting elements can be separated from one another by a portion of the insulating block.

Abstract: Systems and method are described for a terminal block that can include an insulating block that is composed of an electrically insulating material. The insulating structure can have a first via extending between a first and second opening in the insulating block. A second via can extend between a third and fourth opening in the insulating block. A distance between the first and second openings may be less than a distance between the third and fourth openings. A first electrical conducting element can extend between the first and second openings. A second electrical conducting element can extend between the third and fourth openings. The first and second electrical conducting elements can be separated from one another by a portion of the insulating block.

Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.

Abstract: A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

Abstract: A resistor includes a first resistor element. The first resistor element is connected to at least a first electrical terminal and a second electrical terminal. The first resistor element is configured to directly contact cooling media on at least two surfaces of the first resistor element in order to transfer heat away from the first resistor element. The resistor may also include a second resistor element connected to at least the first electrical terminal and the second electrical terminal, where the second resistor element is configured to directly contact the cooling media on at least two surfaces of the second resistor element in order to transfer heat away from the second resistor element.

Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.

Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.

Abstract: A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.

Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.

Abstract: Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.