Abstract: The present invention relates to a UV curable adhesive composition comprising a UV curable acrylic polymer comprising at least one covalently bound UV-reactive group and a cationic photoinitiator and a method of curing such composition. The invention further includes hot melt pressure sensitive adhesives comprising such cured composition and use of said hot melt pressure sensitive adhesives.

Abstract: Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Abstract: Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Abstract: A treatment process for removing the thiocarbonylthio group from the RAFT polymers without sacrificing the versatile complex architectures of polymer is disclosed. The resultant RAFT polymers have higher optical clarity and less odor than conventionally prepared RAFT polymers.

Abstract: The present invention relates to a UV curable adhesive composition comprising a UV curable acrylic polymer comprising at least one covalently bound UV-reactive group and a cationic photoinitiator and a method of curing such composition. The invention further includes hot melt pressure sensitive adhesives comprising such cured composition and use of said hot melt pressure sensitive adhesives.

Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Abstract: A block-copolymer containing at least two different blocks wherein block A contains (meth)acrylate monomers the copolymer having a glass transition temperature of less than 15° C., block B contains (meth)acrylate monomers the copolymer having a glass transition temperature of more than 25° C. being free of thio-containing substances in the polymer chain, characterized in that one block contains at least one photoinitiator chemically bound to the chain.

Abstract: Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.

Abstract: Disclosed is a method for formation of block copolymers using a Single Electron Transfer Living Radical Polymerization (SET-LRP) process. The process can be used to form di and tri-block copolymers from vinyl monomers. In one embodiment the SET-LRP process comprises initially forming a macroinitiator using SET-LRP to form a first block of a di or tri-block copolymer and then using SET-LRP to form additional blocks of the copolymer. The produced block copolymers have very narrow polydispersity indexes and controlled molecular weights. The process permits incorporation of photoinitiators in any of the block formation reactions. The method also includes purification processes that result in a block copolymer having very low color making it useful in a variety of applications. In one application block copolymers prepared according to the present process can be used in hot-melt adhesives.

Abstract: Radiation curable adhesive compositions comprising an acrylic polymer and a polyolefin find use in the manufacture of pressure sensitive adhesive articles such as, for example, tapes.

Abstract: Disclosed is a method for formation of block copolymers using a Single Electron Transfer Living Radical Polymerization (SET-LRP) process. The process can be used to form di and tri-block copolymers from vinyl monomers. In one embodiment the SET-LRP process comprises initially forming a macroinitiator using SET-LRP to form a first block of a di or tri-block copolymer and then using SET-LRP to form additional blocks of the copolymer. The produced block copolymers have very narrow polydispersity indexes and controlled molecular weights. The process permits incorporation of photoinitiators in any of the block formation reactions. The method also includes purification processes that result in a block copolymer having very low color making it useful in a variety of applications. In one application block copolymers prepared according to the present process can be used in hot-melt adhesives.

Abstract: The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Abstract: High durable polarized film comprising a radiation curable PSA layer for lamination in TFT/LCD applications have high humidity and heat resistance. In one embodiment, the adhesive comprises a UV curable acrylic polymer, a compatible tackifier, a multifunction unsaturated oligomer, and a long chain alkyl acrylate monomer.

Abstract: High durable polarized film comprising a radiation curable PSA layer for lamination in TFT/LCD applications have high humidity and heat resistance. In one embodiment, the adhesive comprises a UV curable acrylic polymer, a compatible tackifier, a multifunction unsaturated oligomer, and a long chain alkyl acrylate monomer.

Abstract: UV curable pressure sensitive adhesive containing an antistatic agent, and films comprising UV cured pressure sensitive adhesives containing antistatic agents, are particularly useful in the manufacture of electrical components.

Abstract: Radiation curable adhesive compositions comprising an acrylic polymer and a polyolefin find use in the manufacture of pressure sensitive adhesive articles such as, for example, tapes.

Abstract: A coating composition which comprises a dispersion in an aqueous medium of a dispersed vinyl polymer which is stabilized in dispersion by the presence of a stabilizer which is an epoxy resin, which has at least two hydrolyzable silane groups and at least one protonated or quaternised amine group.

Abstract: This invention is a silica free curable composition comprisingA) A stable dispersion in an aqueous medium of a First Polymer having a weight average molecular weight of at least 50,000 which is insoluble in water and contains silane groups with hydrolyzable functionality.B) A solution or dispersion in the aqueous medium of a second polymer which has a number average molecular weight between 1,000 and 20,000 and at least two silane groups with hydrolyzable functionality. The non-volatile weight ratio of the first polymer to the second is 40:1 to 1:4.