Patents by Inventor Peter D. Roper

Peter D. Roper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing
    Patent number: 6251787
    Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Daniel C. Edelstein, Wilma J. Horkans, Stephen E. Luce, Naftall E. Lustig, Keith R. Pope, Peter D. Roper
  • Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing
    Patent number: 6153043
    Abstract: Eliminating exposure of PN junctions to light capable of invoking a photovoltaic effect and/or inhibiting the oxidation and reduction reactions induced by the photovoltaic effect prevents the electrochemical dissolution of metal components on semiconductor devices by electrolysis. A darkened enclosure for use on tools for wafer CMP, brush cleaning, unloading, and rinsing will eliminate exposure. Alternatively, illumination of a semiconductor wafer can be limited to wavelengths of light that do not provide enough energy to induce a photovoltaic effect. An inhibitor in the CMP slurry and/or post-CMP water rinse blocks the oxidation and/or reduction reactions. A blocking agent, such as a high molecular weight surfactant, will interfere with both the oxidation and reduction reactions at the metal surface. Also, a poisoning agent will impede the reduction portion of electrolysis.
    Type: Grant
    Filed: February 6, 1998
    Date of Patent: November 28, 2000
    Assignee: International Business Machines Corporation
    Inventors: Daniel C. Edelstein, Wilma J. Horkans, Stephen E. Luce, Naftali E. Lustig, Keith R. Pope, Peter D. Roper