Abstract: A substrate center-finding method and apparatus, for determining the center of a substrate being passed through a substrate handling chamber of a substrate processing system, includes any number of sensors arranged in any configuration and permits the substrate to pass through any trajectory that triggers the sensors. The locations of the sensors are calibrated by homing in on the sensors using a point, the reference point, near the tip of an arm assembly on a substrate handler. The substrate handler has an encoder for sensing the pivot angles of links in the arm assembly, whereby the coordinates of the reference point can be calculated from the angles and lengths of the links. When the substrate triggers a sensor, the location of the reference point is again calculated, and the coordinates of the trigger point on the edge of the substrate is determined relative to the reference point.

Abstract: The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.

Abstract: An integrated heated conduit includes an inner conduit through which a fluid may be transferred. The inner conduit may also serve as a first electrical conductor, or an insulator may be provided on the outer surface of the conduit and a first electrical conductor may then be formed about the outer surface of this insulator. A polymeric, self-regulating heating element is provided on the outer surface of the first conductor. A second conductor is provided about the outer surface of the heating element to complete a current path across the heating element. The entire assembly may optionally be sheathed in an electrically and/or thermally insulating outer layer.

Abstract: An apparatus for generating dry vapor includes a manifold assembly with a channel for conveying a liquid from a liquid source. A vessel for holding the liquid is secured to the manifold assembly and includes a fill tube connected to receive liquid from the manifold assembly's channel. A heater is provided for heating the liquid in the vessel to generate a vapor. A settling chamber is located within the vessel above the liquid in the vessel from settling out liquid drops in the vapor. The settling chamber includes a vapor inlet with a cross-section that is substantially smaller than the vessel's cross-section for receiving vapor. A vapor outlet removes dry vapor from the settling chamber.

Abstract: A pneumatic circuit prolongs a pneumatic valve opening time using an accumulator with two quick exhaust type valves in series while providing a rapid valve closing time. This structure and method is self-contained and amenable to retrofit in existing installations without any external connections. Slow opening is achieved by routing inlet gas pressure simultaneously to an accumulator and the operating cylinder of the valve to be opened. A tortuous piping path and increased volume to be pressurized due to the addition of the accumulator substantially reduces the isolation valve opening time, thereby eliminating problems associated with quick opening of a pneumatic valve. When the pneumatic valve needs to be closed quickly, slight venting toward the inlet valve immediately causes the quick exhaust valves to vent their downstream pressure. The accumulator then vents through its quick exhaust valve while separately the main quick exhaust valve quickly vents the air cylinder of the pneumatic valve.

Abstract: A method and apparatus are described for inhibiting visual obstruction of the window of a semiconductor etch process chamber by deposition of each byproducts thereon by selectively heating the window surfaces adjacent one edge of the window to thereby form a cool region on the window surfaces adjacent the opposite edge of the window whereby the center of the window will remain substantially clear of such depositions. The apparatus for carrying out the method of the invention comprises a first heat transmitting structure disposed on one surface of an optically transparent window adjacent one edge, and a second heat transmitting structure disposed on the opposite surface of the optically transparent window adjacent the same edge to thereby provide even heating of both surfaces of the window adjacent the one edge, thereby creating a cooler zone on the window surfaces adjacent the opposite edge of the window.