Abstract: A polycarbonate composition includes particular amounts of a bisphenol A polycarbonate homopolymer, a particular polycarbonate-siloxane copolymer and a phosphazene flame retardant Methods of making the composition and articles including the composition are also described.

Abstract: A system and method for connecting a high voltage wiring harness assembly to a vehicle. The system includes a tubing configured to provide an enclosure for the high voltage wiring harness assembly. The material used to form the tubing includes polytetrafluoroethylene to protect the high voltage wiring harness assembly from abrasion and to insulate the high voltage wiring harness assembly from substantial temperature fluctuations. The system may include an adapter plate configured to provide a mechanical and electrical grounding connection to the vehicle. The system may include a coupling assembly configured to couple the tubing and the adapter plate. The coupling provides a water tight seal between the tubing and the adapter plate. The high voltage wiring harness assembly includes a grounding braid. The coupling assembly is further configured to couple the grounding braid to the adapter plate for completing an electrical circuit between the grounding braid and the vehicle.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A superconducting waveform synthesizer produces an arbitrary waveform and includes an encoder that produces a bitstream; a pattern generator that produces a current bias pulse from the bitstream; a Josephson junction that produces a quantized output pulse from the current bias pulse; and a converter that produces an arbitrary waveform from the quantized output pulse. A process for producing an arbitrary waveform includes producing a bitstream; producing a current bias pulse from the bitstream; communicating the current bias pulse to a Josephson junction; producing, by the Josephson junction, a quantized output pulse from the current bias pulse; producing a quantized output pulse from the current bias pulse; and producing an arbitrary waveform from the quantized output pulse.

Abstract: A microwave energy application apparatus for irradiating a material, comprising: at least one microwave energy source configured to generate microwave energy; at least one microwave applicator having a microwave energy emitting face comprising a dielectric resonator or a slow-wave microwave applicator for directing microwave energy towards the material to be irradiated; and a waveguide coupling microwave energy from the microwave energy source to the microwave applicator for application to a material to be treated.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A transfer module for transferring power to a non-thermal plasma generator includes a power cable; a first epoxy; a second epoxy; an interface between the first epoxy and the second epoxy; and a well; the power cable including a conductor for conducting electrical power and an insulation layer for surrounding a portion of the conductor; the first epoxy being located within the well to surround the insulation layer; the second epoxy being located within the well to surround the conductor located within the well; the second epoxy being located outside the well to surround the conductor located outside the well.

Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Abstract: A conveyor belt including a plurality of interconnected wire segments forming a conveying surface to convey at least one article from one point to another. The conveying surface has first and second outermost edges. Preferably, each of the plurality of wire segments has open end regions permitting interlocking of adjacent wire elements without subsequent forming or reforming of the end regions. The outermost edges of the conveyor belt are formed to reduce the likelihood of snagging and/or injury.

Abstract: Computer-aided detection (CAD) systems are now commonly used in both screening and diagnostic mammography. As the number of cases processed by CAD systems increase, new functionality must be added to provide efficient processing. This invention provides the capability to interrupt a batch processing run allowing a high priority case to be processed before the expected completion of the batch run. Upon completion of the high priority case, the batch processing continues from the point of interruption with minimal user intervention.

Abstract: A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.

Abstract: A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator.

Abstract: An endless conveyor belt comprising a plurality of interconnected segments forming a conveying surface to convey at least one article from one point to another. The conveying surface preferably has first and seconds ends and a plurality of openings. A splicing member preferably connects the first end of the conveying surface to the second end of the conveying surface to form an endless conveyor belt. The splicing member preferably includes at least first and second sections, a connecting member and at least one sealing member. The connecting member has first and second ends. A portion of the first section is connected to the first end of the connecting member thereby forming a first exposed area. A portion of the second section is connected to the second end of the connecting member thereby forming a second exposed area. The at least one sealing member is deposed relative to the connecting member and the first and second sections to seal at least one of the first and second exposed areas.