Patents by Inventor Peter Frasch

Peter Frasch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of adjusting the edge angle in polysilicon
    Patent number: 4452881
    Abstract: The invention relates to a method of adjusting the edge angle of openings that are etched in a polysilicon layer.The steepness of the edge angles can be adjusted by means of a treatment of the polysilicon layer prior to the making of the photoresist mask with a mixture of 5 parts water and 1 to 3 parts ammonia and 0.25 to 1 part hydrogen peroxide. This pre-treatment is advantageously carried out at a temperature between 40.degree. and 70.degree. C.
    Type: Grant
    Filed: May 16, 1983
    Date of Patent: June 5, 1984
    Assignee: International Business Machines Corporation
    Inventors: Wolfgang Augstein, Peter Frasch, Blanka Ivancic, Markus A. Zuegel
  • Method of improving the adherence of metallic conductive lines on polyimide layers
    Patent number: 4152195
    Abstract: A method of improving the adherence of conductive metallic lines to a polyimide resin layer by incompletely curing the polyimide resin prior to deposition of the metal layer, and subsequently completely curing the polyimide resin layer after the metal layer is deposited.
    Type: Grant
    Filed: August 18, 1977
    Date of Patent: May 1, 1979
    Assignee: International Business Machines Corporation
    Inventors: Dieter Bahrle, Peter Frasch, Wilfried Konig, Friedrich Schwerdt, Ursula Thelen, Theodor Vogtmann
  • Etchant for polyimides
    Patent number: 4039371
    Abstract: A composition for etching polyimide based polymers comprised of a tetraalkyl ammonium hydroxide and an organic acid selected from the group of acetic acid, tartaric acid and oxalic acid.The etchant may be used to texture polyimide films or form perforations through polyimide substrates or layers, particularly in the fabrication of printed circuits and semiconductor devices where via holes are required for interconnection of circuitry.
    Type: Grant
    Filed: August 30, 1976
    Date of Patent: August 2, 1977
    Assignee: International Business Machines Corporation
    Inventors: Friedrich Brunner, Peter Frasch, Friedrich Schwerdt